Substrate Processing Temperature Setting via Container Film Thickness
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Solution Overview
Problem
Existing substrate processing apparatuses require repetitive operations for parameter adjustment and film thickness measurement to achieve uniform film thickness across substrates, leading to inefficiencies.
Innovation Solution
A method involving acquiring reference information on thermal effects and film thickness of a processing container, estimating film thickness based on thermal indices, and correlating this information with substrate film thickness to reduce the need for repeated measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If repetitive substrate processing and film thickness measurement are performed to achieve uniform film thickness, then manufacturing precision is improved, but productivity deteriorates
Solution Approach 1:
The patent performs preliminary substrate processing to form a film on the processing container before actual substrate processing. This preliminary film serves as a thermal reference that allows estimation of substrate film thickness based on container film thickness, eliminating the need for repeated measurements during parameter adjustment
Solution Approach 2:
The processing container acts as an intermediary object. By forming a film on the container and measuring its thickness, the system indirectly estimates the film thickness on substrates through thermal effect correlation, replacing direct substrate measurements with container-based measurements
2Manufacturing precision
If repetitive parameter adjustment operations are performed, then manufacturing precision is improved, but loss of time increases
Solution Approach 1:
The patent implements a feedback mechanism where film thickness measurements from the processing container are used to estimate substrate film thickness, which then feeds back into parameter adjustment decisions. This reduces the number of adjustment cycles needed while maintaining precision
Solution Approach 2:
The system creates a thermal model by copying the thermal characteristics from the processing container to the substrates. By measuring film thickness on the container and using thermal correlation, the system infers substrate film thickness without direct measurement, reducing iterative adjustments
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances operational efficiency by eliminating the need for repeated film thickness measurements on substrates, thereby accelerating the process of achieving uniform film thickness.
Implementation Method 1
a temperature controller that controls temperatures of the substrates accommodated within the processing container, for each of zones set in advance
Implementation Method 2
a processing container that performs substrate processing to form a film on each of a plurality of substrates
Implementation Method 3
acquiring a first index indicating a thermal effect of temperature control of the temperature controller on the processing container
Data Source
AI summary
A parameter setting method includes: (a) acquiring a first index indicating a thermal effect of a temperature control of a temperature adjustment unit on a processing container of a substrate processing apparatus when no film is present on an inner surface of the processing container; (b) acquiring a film thickness of a film on the inner surface of the processing container, and a second index indicating a thermal effect of the temperature control of the temperature control unit on the processing container when the film is present on the inner surface of the processing container; and (c) acquiring a third index indicating a thermal effect of the temperature control of the temperature adjustment unit on the processing container when a film is formed on the inner surface of the processing container, and estimating a film thickness of the film formed on the inner surface of the processing container.