Container Packaging Apparatus Sealing Line Formation
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Solution Overview
Problem
Existing container packaging methods for semiconductor wafers lack sufficient sealing reliability during transfer between manufacturing facilities, risking contamination from external environments.
Innovation Solution
A container packaging apparatus featuring a moving table, bag supply unit, load port with support blocks, and a thermosetting unit with a heating coil and elastic pad, which forms a sealing line on a vinyl bag to ensure airtight sealing, using a vinyl bag with specific thickness and winding patterns to prevent tearing and ensure uniform heat application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a vinyl bag is used to cover the container for sealing, then contamination protection is improved, but the risk of vinyl bag tearing and sealing failure increases
Solution Approach 1:
The patent optimizes the thickness parameter of the vinyl bag to a specific range (0.03mm to 0.05mm) to balance contamination protection and tearing resistance. This parameter change resolves the contradiction by selecting an optimal thickness that provides sufficient sealing while maintaining strength against tearing during handling and thermosetting processes.
Solution Approach 2:
The patent applies different heating intensities to different regions of the vinyl bag through the heating coil, with higher winding density at edges and lower density at the center. This local quality approach ensures uniform heat distribution across the vinyl bag, preventing localized overheating that could cause tearing while maintaining overall sealing integrity.
2Reliability
If uniform heat application is applied to the vinyl bag, then sealing reliability is improved, but the complexity of the heating system increases
Solution Approach 1:
The heating coil is designed with non-uniform winding density, having greater windings per unit length at the edges of the heating block and fewer windings at the center. This local quality variation in the heating system compensates for the natural heat distribution pattern, achieving uniform overall heating of the vinyl bag without requiring complex control systems.
Solution Approach 2:
The heating system is designed to passively achieve uniform heat distribution through its physical structure (varying coil density) rather than requiring active control mechanisms. The heating block's geometry and coil arrangement automatically create uniform heating patterns, simplifying the overall system while maintaining sealing reliability.
3Strength
If the vinyl bag thickness is increased to prevent tearing, then mechanical strength is improved, but heat penetration and sealing efficiency decrease
Solution Approach 1:
The patent identifies an optimal thickness parameter range (0.03mm to 0.05mm) for the vinyl bag that balances mechanical strength and heat penetration. This parameter optimization resolves the contradiction by selecting a thickness that is thick enough to prevent tearing during handling but thin enough to allow efficient heat penetration for sealing.
Solution Approach 2:
The heating coil's local quality variation (higher density at edges, lower at center) compensates for the vinyl bag's thickness by creating corresponding heat intensity variations. This ensures that heat penetrates effectively through the entire vinyl bag thickness, maintaining sealing efficiency even at the optimized thickness range that provides maximum strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively seals the container, reducing the risk of contamination and physical damage to the vinyl bag, thereby enhancing the reliability of semiconductor device manufacturing by maintaining a sterile environment during transport.
Implementation Method 1
a thermosetting unit configured to form a sealing line on the lower part of the vinyl bag to seal the vinyl bag, the thermosetting unit including a heating block having a heating coil
Implementation Method 2
a heating block having a heating coil and an elastic pad in contact with the heating block while the vinyl bag is heated by the heating block
Data Source
AI summary
A container packaging apparatus according to an embodiment includes a moving table supporting a container, a bag supply unit configured to supply a vinyl bag to cover the container on the moving table, wherein the vinyl bag has a sealed upper part and an opened lower part, a load port including a pair of support blocks that support the bottom surface of the container transferred from the moving table and are spaced apart with a gap through which the vinyl bag passes, and a thermosetting unit configured to form a sealing line on the lower part of the vinyl bag to seal the vinyl bag, the thermosetting unit including a heating block having a heating coil and an elastic pad in contact with the heating block while the vinyl bag is heated by the heating block.