Contiguous Plane Infrastructure for Dense Compute Module Racks
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Solution Overview
Problem
Traditional computing systems require separate 'hot' and 'cold' aisles for compute module racks, which limits density and scalability due to the need for distinct infrastructure planes for power, cooling, and data connectivity, making it difficult to efficiently manage and maintain large arrays of compute modules.
Innovation Solution
A contiguous plane infrastructure arrangement where power distribution, liquid cooling, and data connectivity are integrated into adjacent planes, allowing compute module racks to be densely packed without aisle separations, with robotic systems for rack extraction and module access, enabling continuous connection to resources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate hot and cold aisles are used for compute module racks, then cooling efficiency is improved, but rack density and space utilization deteriorate
Solution Approach 1:
The patent merges the previously separate hot aisle and cold aisle configurations into a single contiguous plane infrastructure. Compute module racks are arranged in dense arrays without aisle separations, while power distribution, liquid cooling, and data connectivity infrastructures are integrated into unified adjacent planes that serve all racks continuously.
Solution Approach 2:
The patent transitions from a two-dimensional aisle-based layout to a three-dimensional contiguous plane infrastructure. The power distribution infrastructure, liquid cooling infrastructure, and data connectivity infrastructure are arranged in separate adjacent planes above or below the compute module racks, enabling vertical integration rather than horizontal separation.
2Stability of the object's composition
If distinct infrastructure planes are provided for power, cooling, and data connectivity, then system organization is improved, but infrastructure complexity and scalability deteriorate
Solution Approach 1:
Each infrastructure plane (power distribution, liquid cooling, data connectivity) is designed to serve multiple compute module racks simultaneously through continuous coverage. The infrastructures are configured with service loops and redundant pathways that enable any rack to be connected to any point along the infrastructure plane, providing universal access and eliminating the need for rack-specific infrastructure configurations.
Solution Approach 2:
The infrastructure is segmented into distinct functional planes (power, cooling, data) that can be independently configured, maintained, and scaled. Each plane is further divided into modular sections with standardized connection points, allowing incremental expansion and localized maintenance without disrupting the entire system.
3Temperature
If hot and cold aisles are separated, then thermal management is improved, but ease of maintenance and scalability deteriorate
Solution Approach 1:
The liquid cooling infrastructure is configured as a continuous plane with service loops that provide uninterrupted cooling flow to all compute module racks. The continuous configuration allows cooling to be maintained system-wide while enabling localized maintenance of individual rack connections without disrupting thermal management of other racks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases rack density, reduces infrastructure complexity, and facilitates scalable computing systems by eliminating the need for hot and cold aisles, allowing for efficient power distribution, cooling, and data connectivity while enabling easy maintenance and scaling.
Implementation Method 1
A liquid cooling infrastructure including liquid supply and return lines arranged in a plane adjacent to the array of compute module racks with each compute module rack coupled to the liquid cooling infrastructure
Implementation Method 2
A power distribution infrastructure including power supply lines arranged in a plane adjacent to the array of compute module racks with each compute module rack coupled to the power distribution infrastructure
Data Source
AI summary
A computing system includes an array of compute module racks, each compute module rack containing a plurality of compute modules and each compute module being accessible by extracting the compute module rack out of the array of compute module racks. A liquid distribution infrastructure comprising liquid coolant supply lines and return lines is arranged in a first plane adjacent to the array of compute module racks and coupled to each of the vertical racks to provide liquid cooling for the plurality of compute module racks. A power distribution infrastructure comprising power supply lines is arranged in a second plane adjacent to the array of compute module racks and coupled to each of the compute module racks. An optical interconnection infrastructure comprising optical fiber cables is arranged in a third plane adjacent to the array of compute module racks and coupled to each of the compute module racks.