Continuous Additive Manufacturing of Adhesives via Photopolymerization
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Solution Overview
Problem
Existing methods for manufacturing adhesives lack precision and versatility, particularly in creating complex shapes and gradients, as die-cutting is inadequate for forming adhesives with unique shapes like wedges or those with varying thicknesses.
Innovation Solution
The development of apparatuses that utilize an actinic radiation-transparent substrate and an irradiation source to direct actinic radiation at predetermined dosages and locations, allowing for the continuous additive manufacturing of adhesives with varying sizes and shapes by polymerizing a composition on the substrate, which can then be transferred to another material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If die-cutting is used to manufacture adhesives, then the manufacturing process is simple, but the ability to create complex shapes and varying thicknesses is limited
Solution Approach 1:
The patent replaces the mechanical die-cutting system with a photopolymerization-based additive manufacturing system. An irradiation source selectively cures adhesive composition on a transparent substrate at predetermined locations and dosages, enabling complex 3D shapes without mechanical cutting tools. This substitution allows creation of wedge shapes, varying thicknesses, and complex geometries that are impossible with traditional die-cutting.
Solution Approach 2:
The patent utilizes controllable irradiation parameters (dosage, duration, wavelength) to precisely control the polymerization of adhesive composition. By varying these parameters, the system can create adhesives with different thicknesses, shapes, and curing degrees in a single process, providing the versatility that mechanical die-cutting cannot achieve while maintaining manufacturing efficiency.
2Device complexity
If traditional adhesive manufacturing methods are used, then the equipment is simple, but the precision of adhesive delivery is insufficient
Solution Approach 1:
The patent replaces imprecise mechanical adhesive application methods with optically-controlled photopolymerization. The irradiation source can be precisely positioned and controlled to cure adhesive at exact locations with predetermined dosages, achieving high precision in adhesive placement and shaping without complex mechanical positioning systems.
Solution Approach 2:
The transparent substrate serves as an intermediary carrier that enables precise adhesive delivery. The adhesive composition is applied to the substrate and then selectively cured through the substrate by the irradiation source, allowing precise control of adhesive placement and shape while maintaining equipment simplicity.
3Productivity
If die-cutting is used, then the manufacturing process is fast, but unique shapes like wedges cannot be formed
Solution Approach 1:
The patent replaces the binary nature of die-cutting (cut or not cut) with gradient photopolymerization. By controlling irradiation dosage and duration, the system can create continuous variations in adhesive thickness and shape, including wedge shapes and other unique geometries, while maintaining high manufacturing speed through direct selective curing without mechanical tool changes or repositioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the precise and efficient manufacturing of adhesives with complex shapes and gradients, overcoming the limitations of die-cutting by allowing for variations in thickness and shape, and facilitating the transfer of formed adhesives to other substrates.
Implementation Method 1
an irradiation source configured to direct actinic radiation through the actinic radiation-transparent substrate at predetermined dosages at predetermined locations
Data Source
AI summary
Continuous additive manufacturing apparatuses are provided. An apparatus includes an actinic radiation-transparent substrate having a major surface and an irradiation source configured to direct actinic radiation through the actinic radiation-transparent substrate at predetermined dosages at predetermined locations. The apparatus further includes a means for depositing a composition onto the major surface of the actinic radiation-transparent substrate and a means for conveying the actinic radiation-transparent substrate or the irradiation source with respect to each other.


