Chip Package Contact Structure Using a Continuous Conductive Element
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Solution Overview
Problem
Existing chip packages face limitations in vertical interconnect height, stiffness, and manufacturing efficiency, particularly with copper pillars and vertical wires, which restrict flexibility and increase costs.
Innovation Solution
A chip package design featuring a contact structure formed from a continuous longitudinally extended electrically conductive element attached to a chip's contact pad in at least three positions, with the element bending away between positions, and partially encapsulated to expose the structure at the outer surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple vertical interconnects (stud bumps, copper pillars, vertical wires) are used between chip and clip, then electrical connection is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges multiple separate vertical interconnect structures into a single continuous conductive element that provides multiple electrical connections. Instead of using multiple discrete stud bumps, copper pillars, or vertical wires, the invention employs one continuous conductive element that can be attached at multiple positions along its length, thereby achieving the same electrical connection function with reduced structural complexity and manufacturing steps.
Solution Approach 2:
The continuous conductive element serves multiple functions simultaneously: it provides electrical connection at multiple contact positions, acts as a structural support element, and enables flexible height adjustment. This multi-functional design replaces the need for separate components that would otherwise be required to achieve these functions, reducing overall device complexity.
2Reliability
If traditional vertical interconnects (copper pillars, vertical wires) are used, then electrical connection is established, but flexibility in interconnect height is limited
Solution Approach 1:
The continuous conductive element introduces dynamic adjustability to the interconnect height. Unlike fixed-height copper pillars or wires, the continuous element can be configured at various heights by controlling its attachment positions and the spacing between contact points. This dynamic characteristic allows the same basic structure to adapt to different height requirements, enhancing versatility.
Solution Approach 2:
The invention enables parameter changes in interconnect height by varying the configuration of the continuous conductive element. By changing the distance between contact positions, the number of contact points, or the sagging degree of the element, different effective heights can be achieved without changing the fundamental structure, thus providing flexibility in height adjustment.
3Reliability
If multiple discrete interconnect structures are used, then electrical connections are formed, but manufacturing time increases
Solution Approach 1:
The patent combines multiple discrete interconnect formation steps into a single manufacturing process. Instead of separately forming multiple stud bumps, copper pillars, or vertical wires, the continuous conductive element can be attached in one continuous operation, significantly reducing the number of manufacturing steps and overall production time while maintaining reliable electrical connections.
Solution Approach 2:
The continuous conductive element is prepared in advance as a single component that can be directly attached to the chip. This preliminary preparation eliminates the need for on-site formation of multiple discrete interconnects, streamlining the manufacturing process and reducing cycle time.
Data Source
AI summary
A chip package includes a chip with at least one contact pad, a contact structure formed from at least one continuous longitudinally extended electrically conductive element by attaching the conductive element to the contact pad in at least three contact positions, wherein the conductive element bends away from the contact pad between pairs of consecutive contact positions, and an encapsulation partially encapsulating the contact structure, wherein the encapsulation includes an outer surface facing away from the chip, and wherein the contact structure is partially exposed at the outer surface.