Continuous Conductive Sheet for Panel Package Manufacturing
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Solution Overview
Problem
Current methods for manufacturing packages, especially those with electronic components, face inefficiencies in handling and interconnect formation, leading to complex and unreliable processes.
Innovation Solution
The use of a continuous electrically conductive sheet as a mechanical support and interconnect structure, which is partially encapsulated and then patterned to form individual carriers, simplifying the manufacturing process and ensuring robust connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a continuous electrically conductive sheet is used as mechanical support during manufacturing, then handling of electronic components is simplified and mechanical strength is improved, but the sheet must be structured later which adds process steps
Solution Approach 1:
The continuous electrically conductive sheet is prepared in advance as a mechanical support structure before mounting electronic components. This preliminary preparation simplifies subsequent handling and assembly operations, as the sheet provides a stable base for component placement and interconnect formation.
Solution Approach 2:
The continuous sheet is subsequently structured into individual carriers by removing material between adjacent carriers. This segmentation transforms the initially continuous support structure into discrete carriers, each carrying its mounted components, thereby enabling package separation while maintaining the benefits of batch processing.
2Ease of manufacture
If interconnect structures are formed on a continuous sheet, then electrical coupling is simplified, but the sheet must be patterned after interconnect formation which increases manufacturing complexity
Solution Approach 1:
Multiple manufacturing operations are combined by performing interconnect structure formation while components are mounted on the continuous sheet. This merging of operations simplifies the overall process compared to traditional methods where carriers are prepared separately, as the continuous sheet serves as a common platform for both component mounting and interconnect fabrication.
Solution Approach 2:
Interconnect structures are formed in advance on the continuous sheet before the sheet is structured into individual carriers. This preliminary formation of electrical connections ensures that interconnect reliability is established early in the process, and subsequent sheet structuring does not compromise these connections.
3Reliability
If the sheet is structured after encapsulation, then gaps between carriers are non-encapsulated improving reliability, but the manufacturing sequence becomes more complex
Solution Approach 1:
The conventional sequence is inverted by structuring the sheet into individual carriers after encapsulation rather than before. This inversion allows the encapsulant to be applied continuously across the entire sheet surface, filling potential gaps between carriers during the encapsulation process. Subsequent structuring then creates gaps that are not filled with encapsulant material, improving electrical isolation and package reliability.
4Productivity
If batch manufacturing is performed on a continuous sheet, then productivity is improved, but handling and processing complexity increases
Solution Approach 1:
The continuous electrically conductive sheet serves multiple functions simultaneously: it provides mechanical support for mounted components, acts as a common platform for interconnect structure formation, and serves as the carrier substrate itself. This multi-functionality enables efficient batch processing of multiple packages on a single sheet while maintaining simplicity in each individual processing step.
Data Source
AI summary
A method of manufacturing packages is disclosed. In one example, the method comprises providing an electrically conductive sheet being continuous at least in a mounting region, mounting first main surfaces of a plurality of electronic components on the continuous mounting region of the sheet and forming interconnect structures for electrically coupling second main surfaces of the electronic components with the sheet. The second main surfaces oppose the first main surfaces. After the forming, structuring the sheet.