Continuous Wick Structure for Heat Conducting Device
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Solution Overview
Problem
Conventional manufacturing methods of heat conducting devices result in discontinuous wick structures at the welding portions of heat pipes and vapor chambers, leading to additional thermal resistance and reduced heat conducting efficiency.
Innovation Solution
A manufacturing method that forms a continuous wick structure by disposing wick structures on the internal walls of heat conducting elements and vapor chambers, connecting them to form a chamber without thermal obstructions, allowing for rapid transfer of gaseous and liquid working fluids, and optionally incorporating heat dissipating fins for enhanced efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the heat pipe is inserted into the vapor chamber and welded to the top surface, then the heat conducting device can be assembled, but the wick structure becomes discontinuous at the welding portion, creating additional thermal resistance
Solution Approach 1:
The wick structure is preliminarily disposed to extend from the heat pipe into the vapor chamber before welding occurs. This preliminary positioning ensures that when the heat pipe is subsequently welded to the vapor chamber, the wick structure remains continuous and uninterrupted, eliminating thermal resistance at the junction while still allowing the assembly process to proceed.
2Device complexity
If the wick structure is disposed on the inner wall of the heat pipe and vapor chamber, then the device structure is formed, but the wick structure is discontinuous at the connecting portions, reducing heat conducting efficiency
Solution Approach 1:
The wick structure on the heat pipe and the wick structure on the vapor chamber are merged into a single continuous structure. The method involves disposing the wick structure such that it extends from the heat pipe through the welding interface and into the vapor chamber, combining what would otherwise be separate wick segments into one uninterrupted capillary network that maintains thermal efficiency across the entire device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves higher heat conducting efficiency by eliminating thermal resistance and enabling uninterrupted fluid flow, resulting in improved performance for heat dissipating devices.
Implementation Method 1
disposing a first wick structure on an internal wall of the heat conducting element and a bottom surface of the plate body; disposing a second wick structure on an internal wall of the second plate
Implementation Method 2
allowing for rapid transfer of gaseous and liquid working fluids
Data Source
AI summary
A manufacturing method of a heat conducting device includes following steps: providing a first plate, which includes a plate body and at least a heat conducting element, wherein the plate body has at least an inserting end disposed corresponding to the heat conducting element and defining a tube, and the heat conducting element is mounted at the tube; providing a second plate, which has a first opening end; disposing a first wick structure on an internal wall of the heat conducting element and a bottom surface of the plate body; disposing a second wick structure on an internal wall of the second plate; and connecting the plate body to the first opening end so as to connect the first plate and the second plate to form a chamber. Accordingly, the heat conducting device has a higher heat conducting efficiency.