Contour Ring Package Lid Structure for Warpage and Heat Dissipation

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Solution Overview

Problem

Existing semiconductor packaging technologies face challenges in efficiently dissipating heat and maintaining coplanarity (COP) due to substrate warpage, which affects the performance and reliability of advanced packaging structures like Chip-on-Wafer-on-Substrate (CoWoS) and Package-on-Package (PoP) devices.

Innovation Solution

The implementation of a contour ring and top lid structure over the substrate, where the contour ring has an opening that exposes the package and is secured with adhesive materials, followed by mounting a top lid that extends into the opening, providing structural support and uniform thermal interface material distribution to mitigate substrate warpage and enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If advanced packaging structures like CoWoS and PoP are implemented to increase integration density, then component density and functionality are improved, but substrate warpage occurs leading to poor coplanarity

Engineering Contradiction:

Improveintegration densityVSAvoidcoplanarity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The top lid is segmented into multiple portions (first portion, second portion, third portion) that can be positioned at different heights and orientations. This segmentation allows each portion to independently compensate for local warpage variations across the substrate, enabling the overall structure to achieve coplanarity while maintaining high integration density through advanced packaging configurations.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent changes the physical parameters of the top lid by forming it with varying thicknesses and heights in different regions. The first portion has a first height, the second portion has a second height, and the third portion has a third height that is less than both the first and second heights. This parameter variation allows the structure to adapt to substrate warpage and maintain coplanarity across the package surface.

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If conventional packaging structures are used, then manufacturing is simpler, but heat dissipation efficiency is poor

Engineering Contradiction:

Improvepackaging structure simplicityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The patent transitions from conventional two-dimensional packaging layouts to a three-dimensional structure by forming a top lid with varying heights and portions at different vertical levels. This dimensional change creates multiple thermal pathways and increases the surface area for heat dissipation, improving thermal management efficiency while maintaining manufacturing feasibility through established semiconductor packaging processes.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If uniform top lid structure is used over the substrate, then manufacturing is easier, but thermal interface material distribution is non-uniform

Engineering Contradiction:

Improvetop lid fabrication simplicityVSAvoidthermal interface material uniformity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The top lid is designed with non-uniform local qualities, where different portions have different heights and thicknesses optimized for their specific locations. The first portion has a first height, the second portion has a second height, and the third portion has a reduced height. This local quality variation ensures that thermal interface material distributes uniformly across the entire package surface, improving thermal contact between components while maintaining ease of manufacture through a single integrated lid structure.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces substrate warpage, improves coplanarity, and enhances heat dissipation efficiency by ensuring uniform thermal interface material distribution, thereby improving the overall performance and reliability of semiconductor packages.

Implementation Method 1

the contour ring is secured to the substrate with adhesive materials

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

providing structural support and uniform thermal interface material distribution to mitigate substrate warpage and enhance heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250349629A1Package structure and method for forming the same

Publication Date: 2025.11.13 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure includes a substrate. A package is over the substrate. A contour ring is mounted over the substrate, in which the contour ring surrounds the package and has an opening. A top lid is mounted over the contour ring, in which the top lid has a portion extending into the opening of the contour ring.