Contoured Die IC Package Eliminating Delamination
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Solution Overview
Problem
Existing integrated circuit package systems face challenges in reducing size, cost, and improving reliability due to the limitations of conventional manufacturing methods and the use of die-attach paddles, which can lead to delamination and reliability issues under various environmental stresses.
Innovation Solution
The integrated circuit package system features a contoured die with extensions overhanging the base portion, eliminating the need for a separate support structure and die-attach adhesive, allowing for a package encapsulation that exposes external interconnects and enhances reliability by accommodating larger die sizes within the same footprint without delamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If conventional die-attach paddles are used to provide support and planar rigidity, then structural stability is improved, but delamination and reliability problems occur under environmental stresses
Solution Approach 1:
The invention extracts and eliminates the die-attach paddle component from the package system. By removing this intermediate component, the patent avoids the delamination issues that occur between the paddle and encapsulation under environmental stresses, while still achieving structural stability through direct die mounting on the lead frame
Solution Approach 2:
The invention merges the functions of the die-attach paddle and die-attach adhesive into a single integrated solution where the die is mounted directly to the lead frame. This consolidation eliminates the multiple interfaces that are prone to delamination, improving reliability while maintaining structural support
2Adaptability or versatility
If integrated circuit functions are integrated into a single die, then functionality is improved, but die size increases necessitating more expensive or higher profile packages
Solution Approach 1:
The invention utilizes the vertical dimension by allowing the die to extend beyond the coplanar surface of the lead frame. This out-of-plane extension provides additional horizontal footprint without increasing package height, enabling larger functional dies to be accommodated within the same package envelope
3Ease of manufacture
If existing manufacturing processes are reused to reduce cost, then manufacturing cost is improved, but package dimensions do not decrease
Solution Approach 1:
The invention changes the geometric parameters of the die by creating a contoured structure with extensions. This allows the die to utilize vertical space and extend beyond the coplanar surface, effectively reducing the horizontal package footprint while maintaining compatibility with existing manufacturing processes
4Ease of operation
If die-attach paddle and adhesive are used to mount die, then ease of assembly is improved, but delamination risks increase under moisture and thermal stress
Solution Approach 1:
The invention extracts and eliminates the die-attach paddle component from the assembly. By removing this intermediate layer, the patent eliminates the primary site of delamination that occurs under moisture and thermal stress, while simplifying the assembly process to direct die mounting on the lead frame
Data Source
AI summary
An integrated circuit package system is provided including forming an external interconnect, providing a contoured integrated circuit die having both an extension and a base portion with the extension extending beyond the base portion, placing the contoured integrated circuit die with the base portion coplanar with the external interconnect and the extension overhanging the external interconnect, connecting the contoured integrated circuit die and the external interconnect, and forming a package encapsulation over the contoured integrated circuit die and the external interconnect with both partially exposed.