3D Contoured Probe Bonding for Dual-Wall Turbine Components
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Solution Overview
Problem
Existing bonding systems for dual wall structures in gas turbine engines face challenges in efficiently bonding complex geometry components with high thermal loads, often resulting in deformation and damage during the bonding process.
Innovation Solution
A bonding system utilizing a plurality of bonding probes with three-dimensional contoured tips that align with the 3D contoured surfaces of dual wall structures, coupled with controller circuitry for precise alignment and control of the bonding process, including processor and sensor circuitry to manage the bonding process and minimize deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding systems are used for dual wall structures, then bonding can be achieved, but deformation and damage occur during the bonding process
Solution Approach 1:
The bonding system divides the bonding process into multiple discrete bonding locations that are addressed sequentially. The system segments the dual wall structure into specific bonding zones and applies bonding forces independently at each location, preventing cumulative deformation and damage that would occur with conventional simultaneous bonding approaches.
Solution Approach 2:
The system performs preliminary positioning and alignment of the dual wall structure before applying bonding forces. Sensor circuitry pre-locates the structure and controller circuitry pre-plans the bonding sequence to minimize deformation. This preliminary action ensures that bonding occurs at optimal locations and in an optimal sequence, preventing damage during the bonding process.
2Strength
If bonding is applied to complex geometry dual wall structures, then structural strength is improved, but deformation and damage increase
Solution Approach 1:
The bonding system applies localized bonding forces at specific discrete locations on the dual wall structure rather than uniform bonding across the entire structure. The controller circuitry identifies specific bonding locations based on the complex geometry and applies bonding only where structurally necessary, maintaining geometric accuracy in non-bonded areas while achieving required structural strength at critical joints.
Solution Approach 2:
The system dynamically adjusts bonding parameters based on real-time sensor feedback during the bonding process. The controller circuitry monitors deformation and damage indicators and dynamically modifies bonding forces, temperatures, and pressures to maintain geometric accuracy while achieving structural strength. This dynamic control allows the system to adapt to the complex geometry and prevent deformation.
3Productivity
If conventional bonding methods are used, then bonding speed is maintained, but deformation and damage occur
Solution Approach 1:
The bonding system maintains continuous productive action by sequentially bonding multiple locations without idle time between operations. The controller circuitry coordinates the bonding sequence to eliminate downtime, and the system continuously monitors and adjusts parameters to prevent deformation while maintaining bonding speed. This continuous action ensures high productivity while component integrity is protected through real-time control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively bonds complex dual wall structures with minimal deformation and damage, ensuring a strong metallurgical bond while maintaining the structural integrity of the components.
Implementation Method 1
The cover sheet probe and inner pedestal probe apply a localized pressing force to the pedestal and the cover sheet at the respective predetermined locations. Electric power is applied along the conductive electric path to heat a junction between the cover sheet and pedestal.
Implementation Method 2
The cooling system may include a pump, heat exchanger, temperature sensor, and supply lines. The cooling system may circulate a cooling fluid through the bonding probes and/or tips to cool the bonding probes and/or tips.
Data Source
AI summary
A bonding system is used for bonding a cover sheet to a core to form or repair a dual wall structure. The bonding system includes a plurality of bonding probes and controller circuitry. The bonding probes include a three dimensional (3D) contoured tip configured to align with a predetermined area of a 3D contoured cover sheet of a dual wall structure. The controller circuitry comprises processor circuitry and sensor circuitry. The sensor circuitry provides a location of an area of the 3D contoured cover sheet for bonding. The processor circuitry identifies a bonding probe having a contacting area that aligns with the 3D contour of the cover sheet in the location provided by the sensor circuitry.