Electronic Control Apparatus Thermal Management
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Solution Overview
Problem
Existing electronic control apparatuses for vehicles face inefficiencies in heat radiation due to large peripheral clearances that reduce heat conductivity, leading to compromised heat radiation performance.
Innovation Solution
The apparatus features recessed portions on the enclosure members to facilitate closer proximity of heat-generating components to the enclosure, reducing peripheral clearances and enhancing heat conduction, with heat radiation members strategically placed within these recessed areas for improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a protruding portion is formed on the inner wall surface side of the enclosure member or a heat radiation member is interposed between the protruding portion and the heat-generating component, then heat conduction from the heat-generating component to the enclosure member is facilitated, but the heat radiation from the outer wall surface side of the enclosure member into the air is not adequately carried out
Solution Approach 1:
The invention transitions from a protruding portion extending inward to a recessed portion formed on the inner wall surface, changing the geometric dimension and orientation of the heat conduction structure. This recessed configuration allows the heat radiation member to be encircled by the inner wall surface, creating a multi-dimensional heat conduction path that improves both heat conduction efficiency and heat radiation performance simultaneously.
2Ease of manufacture
If the peripheral clearance between the enclosure member and the circuit board is large, then the assembly is easier to manufacture, but the heat radiation performance is deteriorated due to reduced heat conductivity
Solution Approach 1:
The heat radiation member acts as an intermediary substance filling the peripheral clearance between the enclosure member and circuit board. This intermediary material provides thermal conduction pathways through the clearance space, enabling effective heat transfer even when manufacturing tolerances result in variable clearance dimensions, thus maintaining heat radiation performance while preserving manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat radiation performance by minimizing peripheral clearances and maintaining heat radiation member position stability, resulting in lower operating temperatures and improved thermal efficiency.
Implementation Method 1
the heat from the heat-generating component is easily conducted to the enclosure member side through the recessed portion
Data Source
AI summary
A heat-generating component (3) is mounted on a surface (4b), on a case (12) side, of a circuit board (4). A recessed portion (5) is formed in a position facing the heat-generating component (3), on an inner wall surface (12e) side of a bottom wall (12a) of the case (12). Between an inner wall surface (5a) of this recessed portion (5) and the heat-generating component (3), a predetermined-sized component clearance (Ca) is provided, and a heat radiation member (6) is interposed in a position of the component clearance (Ca). A peripheral clearance (Cb) is provided between the surface (4b), on the case (12) side, of the circuit board (4) and the inner wall surface (12e) of the bottom wall (12a) of the case (12) on a peripheral edge side of the recessed portion (5).