Outdoor Unit Control Board Layout for Heat Dissipation and Compact Assembly
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Solution Overview
Problem
The layout of electrical control boards in air conditioners results in large board sizes, inefficient heat dissipation, and complicates component assembly and connection processes, limiting design flexibility and assembly efficiency.
Innovation Solution
The electrical control board is divided into distinct mounting areas for different circuits, concentrating heat-generating components on one side to facilitate heat dissipation and optimizing the layout for a more compact and efficient design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If power devices are concentrated on one side of the substrate, then heat dissipation efficiency is improved, but the layout complexity increases
Solution Approach 1:
The substrate is divided into distinct mounting areas (first, second, third, and fourth mounting areas) with specific circuits grouped together. Power devices (active PFC control circuit and frequency conversion control circuit) are concentrated in the second mounting area adjacent to the first side edge, while other circuits are distributed in separate areas. This segmentation enables focused heat dissipation for power devices while maintaining organized layout structure.
2Area of stationary object
If the control board size is reduced, then space usage is optimized, but component assembly difficulty increases
Solution Approach 1:
The control board is segmented into functional mounting areas that can be independently populated with components. This allows for modular assembly processes where components are assembled in specific zones, reducing overall assembly difficulty despite the compact size. The distinct mounting areas enable systematic component placement and assembly workflows.
Solution Approach 2:
Different mounting areas are optimized for different component types and assembly requirements. The second mounting area concentrates power devices that may require specific assembly procedures, while other areas accommodate different circuit components. This local optimization facilitates easier manufacturing by allowing specialized assembly techniques in specific zones without affecting the entire board.
3Area of stationary object
If circuits are densely packed, then the footprint is minimized, but heat dissipation becomes less efficient
Solution Approach 1:
The substrate is divided into four distinct mounting areas that separate heat-generating power circuits from other circuits. The second mounting area specifically houses power devices adjacent to the first side edge, creating dedicated thermal zones. This segmentation allows for optimized thermal management while maintaining compact overall footprint by efficiently utilizing board space.
Data Source
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AI summary
An electrical control board (1000), comprises a substrate (100) including a first mounting area (110), a second mounting area (120), a third mounting area (130), and a fourth mounting area (140), wherein the substrate (100) comprises a first side edge and a second side edge in the lengthwise direction thereof; the first mounting area (110) and the second mounting area (120) are close to the first side edge and are sequentially arranged in the width direction of the substrate (100); and the third mounting area (130) and the fourth mounting area (140) are close to the second side edge and are sequentially arranged in the width direction of the substrate (100). A main control chip circuit (200), an active power factor correction control circuit (300), a frequency conversion control circuit (400), a power input circuit (500) and a functional interface circuit (600) are respectively mounted in the corresponding mounting areas.