Electronic Control Device Casing Heat Dissipation Fins
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Solution Overview
Problem
Existing electronic control devices face a challenge in achieving high heat dissipation performance while maintaining a simple outer casing structure, as complex recesses on the casing surface increase manufacturing costs and reduce shape forming ease.
Innovation Solution
The electronic control device features a casing with first fins that protrude towards high-heat generating components for direct heat dissipation and second fins located between high- and low-heat generating components to block high-temperature air, enhancing heat transfer and maintaining a simple casing surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a recess is formed in the outer surface of the casing to improve heat dissipation, then heat dissipation performance increases, but the outer surface shape becomes complex and manufacturing costs increase
Solution Approach 1:
The invention transitions from modifying the outer surface (2D/3D complex shape) to modifying the inner surface with protrusions. The heat dissipating protrusions extend from the inner surface toward the heat generating component, creating heat dissipation pathways without affecting the simplicity of the outer surface. This dimensional shift resolves the contradiction by achieving heat dissipation enhancement while maintaining outer surface simplicity.
2Ease of manufacture
If the casing thickness is made uniform to maintain shape forming ease, then manufacturing simplicity is maintained, but heat dissipation performance is reduced
Solution Approach 1:
The invention applies local quality by creating heat dissipating protrusions at specific locations on the inner surface that face heat generating components. These localized protrusions provide enhanced heat dissipation exactly where needed, while the rest of the casing maintains uniform thickness for easy manufacturing. This selective modification resolves the contradiction between uniform thickness and heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves high heat dissipation performance while simplifying the casing's external shape and reducing manufacturing costs by eliminating the need for recesses, effectively managing heat transfer and preventing low-heat components from being overheated.
Implementation Method 1
heat generated from the high-heat generating component is transferred to the first fin located right below the high-heat generating component
Implementation Method 2
dissipated from the casing to the exterior through the first fin
Implementation Method 3
When the clearance between the casing and the circuit board is designed as a predetermined dimension so as to cause air in the casing to flow as convection flow
Implementation Method 4
heat generated from the high-heat generating component flows toward the low-heat generating component by the convection flow. Hence, by providing the second fin between the high-heat generating component and the low-heat generating component, high-temperature air can be blocked
Data Source
AI summary
A circuit board of an electronic control device has a surface to which a connector is attached and on which a heat generating component is mounted. A metal casing that stores therein the circuit board has an opposing surface that faces the surface of the circuit board on which the heat generating component is mounted. A first fin that protrudes toward the surface on which the heat generating component is mounted is provided on the opposing surface of the casing. The first fin overlaps the heat generating component in the thickness direction of the circuit board.