Air Conditioner Control Module Layout for Cooler-Supported PCB Access

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Solution Overview

Problem

The outdoor unit of an air conditioner has a cooler disposed on the front side of the printed circuit board, making maintenance difficult and the mechanical strength of the supporting structure low, as the cooler is supported by the printed circuit board.

Innovation Solution

An electrical component module with a fixed plate, upper and lower frames, and a cooler that bridges between these frames, allowing the printed circuit board to be maintained without detaching the cooler and enhancing the mechanical strength of the supporting structure with a simple configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the cooler is disposed on the front side of the printed circuit board to cool power devices, then the cooling function is improved, but the maintenance difficulty increases and mechanical strength decreases

Engineering Contradiction:
Improvepower device temperatureVSAvoidprinted circuit board maintenance
Core Design Contradiction:
TemperatureVSEase of repair

Solution Approach 1:

The support structure is segmented into multiple components: a support plate attached to the rear surface of the printed circuit board, and a support bracket attached to the case. This segmentation allows the cooler to be mounted on the front side while the support structures are distributed on both rear and front surfaces, enabling maintenance access without removing the cooler.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support structure transitions from a single-plane support to a three-dimensional distributed support system. The support plate extends on the rear surface while the support bracket extends on the front surface, creating a spatial distribution that resolves the conflict between front-side cooling and maintenance accessibility.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If the cooler is supported by the printed circuit board, then the structure is simplified, but the mechanical strength of the supporting structure becomes low

Engineering Contradiction:
Improvesupport structure complexityVSAvoidsupporting structure strength
Core Design Contradiction:
Device complexityVSStrength

Solution Approach 1:

The support function is merged with the cooler mounting structure. The support bracket is integrally formed with the cooler mounting portion, combining the support function with the cooler attachment function into a single structural element that provides both structural strength and cooler mounting capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The support bracket serves multiple functions: it supports the printed circuit board, provides mounting points for the cooler, and reinforces the overall structure. This multi-functionality reduces the need for separate support components while increasing structural strength.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Volume of moving object

If the cooler is disposed on the front side of the printed circuit board, then the space utilization is improved, but the maintenance operation becomes difficult

Engineering Contradiction:
Improvemachine section space utilizationVSAvoidmaintenance operation ease
Core Design Contradiction:
Volume of moving objectVSEase of operation

Solution Approach 1:

The support function is extracted from the printed circuit board and assigned to separate support structures (support plate and support bracket). This extraction allows the printed circuit board to be maintained independently by removing only the support plate, while the cooler remains mounted on the front side through the support bracket.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables easy maintenance of the printed circuit board without removing the cooler and increases the mechanical strength of the supporting structure, improving operational reliability and ease of maintenance.

Implementation Method 1

the heat sink is arranged to be thermally coupled with the printed circuit board 41 to receive the heat produced by the power device 41B1... In the liquid side refrigerant pipe 30L, the refrigerant condensed in the outdoor heat exchanger 11 flows during the cooling operation, and the refrigerant condensed in the indoor heat exchanger 21 and decompressed in the expansion valve 14 flows during the heating operation. Thus, the heat sink of the cooler 50 is cooled on the basis of the temperature of the refrigerant

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentEP3745035B1Electrical component module
Publication Date: 2024.11.13 FUJITSU GENERAL LTD
  • EP3745035B1 patent drawingFigure 1
  • EP3745035B1 patent drawingFigure 2
  • EP3745035B1 patent drawingFigure 3

AI summary

An electrical component module (200) includes: a control unit that controls an air conditioner; a fixed plate (210) on which the control unit is mounted, the fixed plate (210) being arranged to have a front surface (211a) facing a direction toward a service panel; a cooler (300) that is attached to a part of a refrigerant pipe (30L) with the refrigerant pipe (30L) arranged between the cooler (300) and a back surface (211b) of the fixed plate (210); a first frame (220) attached to one end portion of the fixed plate (210); and a second frame (230) attached to another end portion of the fixed plate (210). The control unit includes a printed circuit board (360) on which a power device (274) is mounted. The power device (274) is thermally coupled with the cooler (300). The cooler (300) is attached to bridge between the first frame (230) and the second frame (230).