Electronic Control Module Layout With 3D PCB and EMI Filter Stacking
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Solution Overview
Problem
Existing electronic control devices face challenges in compactly arranging multiple electronic components due to limited space within the housing, and there is a need for improved miniaturization and efficient connection structures.
Innovation Solution
The electronic control device incorporates a housing with first and second plates, each containing control modules, printed circuit boards, power supply substrates, and EMI filters, arranged perpendicularly and connected via pins, pins holes, and screw-coupled coupling parts, eliminating soldering connections and utilizing busbar modules for vertical integration of EMI filters and power supply substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple electronic components are arranged inside the housing, then the functionality of the electronic control device is improved, but the available space for arrangement is reduced making it difficult to compactly arrange components
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional spatial arrangement by disposing electronic components on both the inner and outer surfaces of the plate. The printed circuit board is coupled to the inner surface while the power supply substrate is disposed on the outer surface, utilizing the Z-dimension (thickness direction) to increase component capacity without expanding the housing footprint.
Solution Approach 2:
The patent implements nested arrangement where the EMI filter is positioned between the first plate and second plate, with its inner surface facing the inner surface of the printed circuit board. This nested configuration allows multiple components to occupy overlapping or adjacent spatial regions, maximizing space utilization within the housing.
2Reliability
If traditional soldering connections are used for electronic components, then electrical connectivity is achieved, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The patent replaces the chemical/soldering connection system with a mechanical connection system. Pins are inserted into pin holes to establish electrical connectivity between the printed circuit board and power supply substrate, eliminating the need for soldering operations. This mechanical connection method simplifies the manufacturing process while maintaining reliable electrical connectivity.
Solution Approach 2:
The patent divides the electrical connection interface into discrete pin and pin hole elements. Each pin corresponds to a specific pin hole, creating modular connection points that simplify assembly and inspection. This segmentation allows for easier manufacturing and quality control compared to continuous soldering joints.
3Object-affected harmful factors
If EMI filters and power supply substrates are arranged in the housing, then electromagnetic interference protection and power supply are improved, but the spatial arrangement becomes more difficult
Solution Approach 1:
The patent resolves the spatial arrangement difficulty by utilizing the thickness dimension of the plate. The EMI filter is positioned between the first and second plates, while the power supply substrate is disposed on the outer surface of the plate, perpendicular to the printed circuit board. This three-dimensional arrangement accommodates all components without increasing the housing footprint.
Solution Approach 2:
The patent optimizes the local arrangement of components based on their functional requirements. The EMI filter is positioned with its inner surface facing the inner surface of the printed circuit board to provide targeted electromagnetic shielding where needed. The power supply substrate is arranged on the outer surface to facilitate power distribution, creating an optimized local configuration for each component.
Data Source
AI summary
The electronic control device includes: a housing; a first plate disposed in the housing; a second plate disposed in the housing and having an inner surface facing the inner surface of the first plate; a first control module disposed in the housing; and a second control module disposed in the housing, wherein the first control module includes: a first printed circuit board having an inner surface coupled to one side of the first plate and one side of the second plate; a first power supply substrate disposed on an outer surface of the second plate; and a first EMI filter disposed between the first plate and the second plate, an inner surface of which is opposite to an inner surface of the first printed circuit board, and wherein the second control module includes: a second printed circuit board having an inner surface coupled to the other side surface of the first plate and the other side surface of the second plate; a second power supply substrate disposed on an outer surface of the first plate; and a second EMI filter disposed between the first plate and the second plate, an inner surface thereof faces an inner surface of the second printed circuit board.