Control module for an electric appliance
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Solution Overview
Problem
Existing add-on electric heating devices for motor vehicles face challenges in managing heat dissipation from power transistors, leading to potential damage to other electronic components due to insufficient heat conduction reduction, especially when using high-power modules or when MOSFETs are damaged.
Innovation Solution
A control module design where the power electronic component, such as a MOSFET, is separated from the printed circuit board using electrical link members and mounted on a substrate with a U-shaped slit, preventing heat conduction to other components and allowing for easy assembly and handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If MOSFETs are placed directly on the printed circuit board, then the device complexity is reduced and ease of manufacture is improved, but heat conduction to other electronic components occurs causing reliability degradation
Solution Approach 1:
The control module is segmented into distinct functional zones: a first substrate for power electronic components (MOSFETs) and a second substrate for other electronic components. This spatial segmentation prevents heat conduction from MOSFETs to other components while maintaining modular assembly. The printed circuit board is also segmented with a slit to physically separate the heat generation zone from other zones.
Solution Approach 2:
The power electronic components generating heat (MOSFETs) are extracted from the common substrate and placed on a separate first substrate. This extraction removes the heat source from proximity to other electronic components, eliminating the heat conduction problem while allowing independent optimization of each substrate's layout and thermal management.
2Reliability
If U-shaped slits are provided to limit heat conduction, then some heat isolation is achieved, but heat conduction through bridges of material remains insufficient for high-power applications
Solution Approach 1:
The printed circuit board is completely segmented into separate zones using slits that extend from the edge through the board thickness. This complete segmentation eliminates thermal bridges of material that exist in conventional designs, providing sufficient heat isolation for high-power heating modules where partial slits are inadequate.
3Ease of manufacture
If MOSFETs with higher resistance are used to reduce cost, then the cost is reduced, but heat dissipation increases requiring better heat management
Solution Approach 1:
MOSFETs are extracted from the main circuit board and mounted on a dedicated first substrate designed for power handling. This extraction allows the use of higher resistance, cost-effective MOSFETs because the thermal isolation protects other components from the increased heat dissipation, enabling cost reduction without compromising system reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents heat transfer to other electronic components, enabling the use of higher resistance, cost-effective MOSFETs and high-power heating modules while ensuring the safety and reliability of the control module.
Implementation Method 1
a not inconsiderable quantity of heat (2 to 3 watts) is dissipated by the MOSFET, in normal operation
Implementation Method 2
it is known practice to place a part of the conductor bars linking the MOSFETs to the negative terminals of the heating modules in the flow of air, so that a portion of the heat dissipated by the MOSFET is discharged via this flow of air
Data Source
AI summary
The invention relates to a control module (4) for an electric appliance (3), comprising: a printed circuit board (11), on which electrical and electronic components (12) are mounted; and an electronic power component (10) separated from the printed circuit board (11) and held in relation thereto by means of at least one electrical connection body (18a, 18b, 18c) fixed to the printed circuit board (11) and connected to one (D) of the terminals (S, D, G) of the electronic power component (10).