Printed Control Panel Substrate With Single-Firing Circuit Integration
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Solution Overview
Problem
Existing control panel manufacturing processes are complex and costly due to numerous steps, leading to high production expenses.
Innovation Solution
Applying multiple layers of combustible paint and conductive paste to a dielectric base body, baking them simultaneously at a temperature range of 600-700°C to create a scratch-resistant, UV-resistant, and temperature-resistant surface, eliminating the need for additional processing steps and allowing direct integration of electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate manufacturing steps are used for applying paint, conductor paste, and bonding electronic components, then the control panel achieves functional requirements, but the production process becomes complex and costly
Solution Approach 1:
The patent combines multiple separate manufacturing steps (applying paint layers, applying conductor paste, and bonding electronic components) into a single integrated firing process. All layers are applied to the base body and then simultaneously fired at high temperature to achieve bonding and functional integration, eliminating the need for multiple separate processing steps and reducing production complexity
Solution Approach 2:
The patent applies all necessary layers (paint and conductor paste) and positions electronic components on the base body before the single firing process. This preliminary arrangement of all elements prior to firing allows the subsequent high-temperature treatment to simultaneously bond all layers and activate all functional elements in one operation
2Reliability
If multiple separate manufacturing steps are used for applying paint, conductor paste, and bonding electronic components, then the control panel achieves functional requirements, but production time and energy consumption increase
Solution Approach 1:
The patent merges multiple sequential manufacturing operations into a single parallel firing process. By applying all layers and positioning all components before one simultaneous high-temperature treatment, the production time is significantly reduced compared to performing paint firing, conductor paste firing, and component bonding as separate sequential steps
Solution Approach 2:
All layers and components are prepared and positioned in advance before the single firing operation. This preliminary arrangement eliminates the need for repeated heating and cooling cycles that would occur with multiple separate firing steps, thereby reducing total production time and energy consumption
3Reliability
If multiple separate manufacturing steps are used for applying paint, conductor paste, and bonding electronic components, then the control panel achieves functional requirements, but production costs increase
Solution Approach 1:
The patent combines multiple billable manufacturing operations (paint application and firing, conductor paste application and firing, electronic component bonding) into a single integrated high-temperature firing process. This consolidation reduces the number of separate processing steps, equipment usage time, and labor requirements, thereby lowering overall production costs while maintaining functional requirements
Solution Approach 2:
All materials and components are prepared and positioned before the single firing operation, eliminating the need for multiple separate processing cycles. This approach reduces waste, minimizes equipment usage, and streamlines production, leading to lower manufacturing costs compared to traditional multi-step processes
4Reliability
If conventional manufacturing processes are used with multiple layers and bonding steps, then functional requirements are met, but the surface resistance to scratching and environmental factors is insufficient
Solution Approach 1:
The patent creates a composite structure where multiple layers (paint layers and conductor paste) are simultaneously fired at high temperature to form a tightly bonded, integrated coating system on the base body. This composite structure, formed through unified high-temperature firing, achieves superior scratch resistance, UV resistance, and temperature resistance compared to conventionally applied and separately fired layers
Solution Approach 2:
By combining all layers and bonding them through a single high-temperature firing process, the patent creates a unified, tightly integrated coating system. The simultaneous firing ensures optimal bonding between all layers and with the base body, resulting in enhanced surface strength and resistance to mechanical and environmental degradation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the production process, reducing time, energy consumption, and costs while achieving a strong bond between layers and a break-resistant, stable surface suitable for outdoor use.
Implementation Method 1
The color and conductor structure layers are firmly bonded to the material of the base body as a result of the firing process
Implementation Method 2
baking the paint and the conductive paste in one operation
Implementation Method 3
the baking temperature of the paint and the conductive paste is in the range from 600 to 700°C
Data Source
Figure 1~2
AI summary
A panel (1) substrate, comprising a dielectric, e.g. glass, glass-ceramic or ceramic, has several colored layers (3) which can be fired onto the rear, comprising vitreous enamel or ceramic. It also includes one or more layers of printed circuit structures, in conductive paste (5). The colors and conductive paste have the same firing temperature, and at least one electronic component (6) is fastened to the rear of the panel. The firing temperature of colors and paste is in the range 600[deg]C-700[deg]C. It is especially 620[deg]C. The substrate is single-layer safety glass. Electronic components in the printed circuit structures, comprise e.g. resistances or sensor components. A screen-printing process, followed by drying, is used to apply the tracks and colors to the substrate panel. An independent claim is included for the corresponding production.