Control Unit Attachment Mechanism for Transmission Carrier Board
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Solution Overview
Problem
Existing methods for attaching control units in transmission control modules of motor vehicles fail to ensure optimal heat conduction due to bonded connections acting as thermally conductive resistors and cause bending stress in carrier boards, with incomplete surface pressing until assembly is complete.
Innovation Solution
A direct attachment mechanism using an attachment element that projects through an opening in the carrier board, allowing for a strong, frictional and positive locking connection between the control unit and the carrier board, eliminating bending forces and enabling direct metal contact without an insulating layer, thus enhancing heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If bonded connections are used to attach the control unit to the carrier board, then the attachment is simple, but the heat conduction is poor due to thermally conductive resistance
Solution Approach 1:
The patent removes the bonding agent layer from the attachment system, extracting the thermal resistance element. The control unit is attached directly to the carrier board through mechanical means (screws or clips) that allow direct metal-to-metal contact, eliminating the thermally conductive resistance of bonded connections while maintaining attachment simplicity.
Solution Approach 2:
The patent introduces a thermal interface material or direct mechanical contact as an intermediary between the control unit and carrier board, replacing the bonding agent. This intermediary provides both mechanical attachment and optimal thermal conduction path, resolving the contradiction between easy manufacture and heat conduction efficiency.
2Strength
If spring clips are used to press the control unit against the carrier board, then the control unit can be attached, but bending stress occurs in the carrier board
Solution Approach 1:
The patent segments the attachment function from the carrier board structure by using separate attachment elements (screws or clips) that are not integrated into the carrier board itself. This segmentation allows the carrier board to remain structurally intact without bending stress, while still achieving strong attachment through the distributed attachment elements.
Solution Approach 2:
The patent uses attachment elements that replicate the holding function of spring clips without their detrimental effects. Instead of flexible spring clips that bend the board, rigid screws or clips are used that transfer loads to localized attachment points, copying the attachment strength while preserving carrier board structural integrity.
3Strength
If a spring is supported on a transmission face, then the control unit can be attached, but the pressing force is not applied until complete assembly
Solution Approach 1:
The patent applies pressing force through attachment elements that are installed and activated during the initial mounting phase, before complete assembly. The screws or clips are tightened to apply the necessary pressing force early in the assembly process, eliminating the time delay associated with spring-supported attachments that only engage after complete assembly.
4Ease of manufacture
If bonded connections are used, then the control unit can be attached, but the oil gap is larger reducing heat transfer
Solution Approach 1:
The patent extracts the bonding agent layer that creates oil gaps, allowing direct contact between the control unit mounting surface and the carrier board. This elimination of the bonding layer reduces the oil gap to minimal thickness, dramatically improving heat transfer efficiency while maintaining attachment capability through mechanical fastening.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures a strong pressing force with minimal oil gap, improving heat transfer efficiency and reducing installation space requirements, while allowing for heat conduction directly to the transmission housing.
Implementation Method 1
a sufficiently strong pressing force is ensured in order to permit a gap which is as small as possible... for a maximum transfer of heat
Implementation Method 2
The attachment device has at least one attachment element which is connected to a circuit mounting device and protrudes with a first end from the circuit mounting device
Implementation Method 3
direct metal contact without an insulating bonding layer... improves the transfer of heat
Implementation Method 4
more metallic contract area can be made available, which improves the transfer of heat
Implementation Method 5
The circuit mounting device can be at least partially surrounded with a sealing compound, wherein the at least one attachment element extends through the sealing compound
Data Source
AI summary
A control unit for a transmission control module of a motor vehicle transmission includes a circuit mounting device and at least one attachment device configured to attach the circuit mounting device to a carrier board. The circuit mounting device includes an electronic circuit and has a first bearing side with which it is configured to be pressed against a second bearing side of the carrier board by the attachment device. The attachment device has at least one attachment element which is connected to the circuit mounting device and protrudes with a first end from the circuit mounting device on the first bearing side. The attachment element is configured to project through an attachment opening in the second bearing side of the carrier board.