Control Wafer Allocation by Chamber ID for Accurate Semiconductor Testing

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Solution Overview

Problem

The manual distribution of control wafers to semiconductor processing equipment's multiple reaction chambers is time-consuming, prone to errors, and can lead to inaccurate test results due to improper identification and contamination, affecting the quality of semiconductor wafer processing.

Innovation Solution

An automated method and apparatus for handling control wafers, which involves setting unique identification numbers for reaction chambers, determining slot numbers for control wafers based on these identifiers, and distributing them accordingly to ensure accurate and efficient allocation, reducing manual intervention and errors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If manual distribution method is used for control wafers, then flexibility in operation is maintained, but distribution efficiency is low and error rate increases

Engineering Contradiction:
Improvedistribution efficiencyVSAvoidmanual intervention level
Core Design Contradiction:
ProductivityVSExtent of automation

Solution Approach 1:

The control wafer distribution system performs automatic identification and allocation based on reaction chamber identification numbers and slot number correspondence relationships, enabling the system to serve itself without manual intervention. The apparatus automatically determines which control wafers should be distributed to which reaction chambers by comparing identification numbers and slot numbers, eliminating the need for manual distribution while maintaining high accuracy.

Inventive Principle:
Principle #25Self-service

2Manufacturing precision

If manual setting and recording is used for control wafer distribution, then device complexity is kept simple, but manufacturing precision of distribution accuracy deteriorates

Engineering Contradiction:
Improvedistribution accuracyVSAvoidsystem complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces manual mechanical distribution operations with an automated identification and allocation system. The system uses identification numbers on reaction chambers and slot numbers on control wafers to automatically determine distribution, substituting human manual operations with an automated apparatus that reads identifiers and performs allocation based on predefined correspondence relationships, thereby improving accuracy while managing complexity through systematic automation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Loss of time

If manual distribution is performed, then time consumption is high, but the simplicity of operation is maintained

Engineering Contradiction:
Improvedistribution timeVSAvoidoperation simplicity
Core Design Contradiction:
Loss of timeVSEase of operation

Solution Approach 1:

The system performs preliminary identification and allocation determination before actual distribution. The apparatus pre-establishes correspondence relationships between reaction chamber identification numbers and control wafer slot numbers, and automatically determines the distribution plan before execution. This preliminary automated determination eliminates time-consuming manual decision-making during the distribution process itself.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20220308560A1Method and apparatus of handling control wafer, method of testing by using control wafer
Publication Date: 2022.09.29 CHANGXIN MEMORY TECH INC
  • US20220308560A1 patent drawing
  • US20220308560A1 patent drawing
  • US20220308560A1 patent drawing

AI summary

The present disclosure provides a method and an apparatus of handling a control wafer, a method of testing by using a control wafer, a computer-readable storage medium and an electronic device, and relates to the technical field of semiconductor equipment. The method of handling a control wafer includes: setting different identification numbers for multiple reaction chambers; determining slot numbers of control wafers according to the identification numbers of the reaction chambers; and distributing the control wafers according to the slot numbers of the control wafers and the identification numbers of the reaction chambers.