Controllable Heat Dissipation Module for Mobile Device Thermal Management
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Solution Overview
Problem
Electronic devices, such as mobile phones, experience local overheating due to high heat generation from components like lenses and processors, causing user discomfort during use.
Innovation Solution
A heat dissipation module comprising a first and second heat transfer member and a cooling element, controlled by a unit to manage heat transfer direction and range, allowing or blocking heat transfer between the members based on user holding modes and power consumption levels to efficiently dissipate heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If heat dissipation is increased to reduce local overheating, then user comfort is improved, but heat transfer control complexity increases
Solution Approach 1:
The patent employs a controllable heat transfer path that can dynamically adjust between different heat dissipation modes. The switching mechanism allows the system to adapt heat transfer characteristics based on operational conditions, transforming a static heat dissipation structure into a dynamic one that can optimize performance while managing complexity through controlled adaptability
Solution Approach 2:
The invention creates different heat dissipation paths for different regions of the device. By providing separate first and second heat transfer members with distinct thermal characteristics, the system addresses local overheating issues in specific areas while maintaining overall thermal balance, allowing targeted heat management without uniformly increasing system complexity
2Loss of energy
If heat transfer path is extended to dissipate more heat, then heat dissipation efficiency is improved, but device volume increases
Solution Approach 1:
The patent combines multiple heat transfer paths into an integrated heat dissipation system where the first and second heat transfer members work together with shared components. This merging approach allows the system to achieve extended heat dissipation capability without proportionally increasing volume, as common structures serve multiple thermal management functions
Solution Approach 2:
The invention employs a nested arrangement where heat transfer members are positioned and structured to utilize available space efficiently. The first and second heat transfer members are arranged to overlap or adjacently nest within the device housing, allowing extended heat dissipation paths to be accommodated within the existing device volume without significant expansion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively maintains user comfort by optimizing heat dissipation paths and reducing temperature exposure in different holding modes, preventing overheating and ensuring efficient heat dispersal during various device operations.
Implementation Method 1
The cooling element is disposed between the second end and the third end and is configured to allow or block the heat transferring between the second end and the third end
Data Source
AI summary
A heat dissipation module and an electronic device are provided. The heat dissipation module includes a first heat transfer member, a second heat transfer member, and a cooling element. The first heat transfer member has a first end and a second end opposite to the first end. The second heat transfer member has a third end and a fourth end opposite to the third end. The cooling element disposed between the second end and the third end is configured to allow or block the heat transferring between the second end and the third end.