Controlled Delamination via Surface Engineering for Nonplanar Nanostructures
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Solution Overview
Problem
Conventional top-down techniques for fabricating nonplanar nanostructures face challenges due to van der Waals and capillary forces, leading to instabilities and low process yield, especially at the few-nanometers scale.
Innovation Solution
A method involving surface engineering to create engineered surfaces on a substrate, followed by the application of a film and controlled delamination using energy, to form nonplanar nanostructures with precise spatial control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional top-down techniques are used to fabricate nonplanar nanostructures, then the fabrication process can be performed, but instabilities caused by van der Waals and capillary forces lead to low process yield
Solution Approach 1:
The patent introduces a sacrificial layer as an intermediary substance between the substrate and the film to be delaminated. This sacrificial layer mediates the interaction by providing a controlled interface that reduces harmful van der Waals and capillary forces during the delamination process, thereby improving process yield while enabling nonplanar nanostructure fabrication
Solution Approach 2:
The patent changes physical parameters such as applying thermal energy or chemical treatment to modify the properties of the sacrificial layer or the film interface. By changing parameters like temperature or chemical composition, the adhesion strength is dynamically adjusted to overcome harmful forces during delamination, resolving the contradiction between achieving delamination and avoiding instabilities
2Length of moving object
If device dimensions are reduced to the few-nanometers regime to improve device efficiency and speed, then device performance is improved, but instabilities become more prominent resulting in low process yield
Solution Approach 1:
The sacrificial layer serves as a mediator that enables precise control at the few-nanometer scale. By using this intermediary, the patent can achieve smaller device dimensions with improved efficiency and speed while maintaining high process yield, as the sacrificial layer protects against instabilities that would otherwise dominate at such small scales
Solution Approach 2:
The patent applies preliminary action by pre-depositing the sacrificial layer before fabricating the nanostructure. This preliminary step prepares the interface in advance to prevent instabilities from developing during subsequent processing, enabling reliable fabrication of ultra-small devices with dimensions in the few-nanometers regime
3Shape
If additive manufacturing or two-photon lithography is used to create three-dimensional nanostructures, then nonplanar structures can be fabricated, but features are limited to greater than 100 nm and structures are not mechanically-active
Solution Approach 1:
The patent replaces mechanical fabrication systems (additive manufacturing, lithography) with a delamination-based approach that uses controlled interfacial failure. This substitution enables feature sizes below 100 nm and creates mechanically-active structures by exploiting the mechanical release of strain energy during delamination, rather than building structures layer-by-layer with mechanical constraints
4Shape
If sacrificial support layer is applied and removed to perform nonplanar fabrication, then nonplanar structures can be formed, but the process becomes complex and yield decreases at small dimensions
Solution Approach 1:
The patent uses preliminary action by pre-forming the sacrificial layer pattern before film deposition. This preliminary patterning simplifies the overall process by enabling subsequent self-aligned delamination, reducing the number of complex steps needed compared to conventional approaches that require multiple alignment and etching operations
Solution Approach 2:
The sacrificial layer acts as a simplifying intermediary that replaces complex multi-step fabrication processes. By using this single intermediary layer, the patent can form nonplanar structures with fewer process steps and lower complexity, particularly at small dimensions where conventional methods become increasingly complicated
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the deterministic fabrication of nonplanar nanostructures with controlled dimensions and mechanical activity, overcoming the limitations of conventional techniques and allowing for diverse applications in nanoelectromechanical systems and other devices.
Implementation Method 1
The surface treatment may include the application of a self-assembled molecular (SAM) layer, which includes an anchoring group that allows assembly on the surface of the substrate
Implementation Method 2
an anchoring group that allows assembly on the surface of the substrate
Implementation Method 3
Energy is then applied to the film, causing it to delaminate in the regions where the surface was treated
Implementation Method 4
these structures suffer from instabilities that are caused by van der Waals and capillary forces
Implementation Method 5
instabilities that are caused by van der Waals and capillary forces
Data Source
AI summary
A method of forming nonplanar nanostructures on a substrate is disclosed. The method includes treating a portion of the surface of the substrate so as to affect its properties. A film is then applied to the substrate after the surface engineering has been completed. Energy is then applied to the film, causing it to delaminate in the regions where the surface was treated, thereby creating the nonplanar nanostructures. The surface treatment may include the application of a self-assembled molecular (SAM) layer, which includes an anchoring group that allows assembly on the surface of the substrate, and also has a functional group that has the desired interaction with the film. The nonplanar nanostructures may be used to form nanoswitches, resonators, and strain engineered surfaces.