Fe-Ni Deposition Mask Plate with Controlled Diffraction and Grain Size
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Solution Overview
Problem
The existing deposition masks for OLED pixel deposition suffer from non-uniform through-hole formation due to uneven etching, leading to reduced deposition efficiency and failures, as a result of surface pits and variations in the depth, diameter, and shape of the through-holes.
Innovation Solution
The iron-nickel alloy metal plate is designed with controlled diffraction intensity ratios and crystal grain sizes to minimize uneven etching, ensuring uniform through-hole characteristics by controlling the diffraction intensity ratios of (111), (200), and (220) planes, and limiting crystal grain areas and diameters to 700 μm² and 30 μm respectively, with a density of 0.20-0.25 ea/μm².
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional metal plates are used for deposition masks, then manufacturing is simpler, but surface pits and uneven etching occur leading to non-uniform through-holes
Solution Approach 1:
The patent applies parameter changes by precisely controlling the diffraction intensity ratios (I111/I200 and I220/I200) and crystal grain parameters (area and diameter) of the metal plate. These parameter specifications ensure uniform etching behavior and prevent surface pit formation, directly resolving the technical contradiction between manufacturing precision and device complexity.
Solution Approach 2:
The patent implements preliminary action by pre-controlling the crystal structure and grain parameters of the metal plate before the etching process. By establishing the desired diffraction intensity ratios and crystal grain characteristics in advance, the metal plate is prepared to resist uneven etching and surface pit formation during subsequent manufacturing steps.
2Reliability
If surface etching is performed to remove impurities, then surface cleanliness improves, but dent phenomenon and pits are generated
Solution Approach 1:
The patent applies beforehand cushioning by pre-establishing optimal crystal grain parameters and diffraction intensity ratios in the metal plate before surface etching. This preliminary structural optimization acts as a cushion against the harmful effects of etching, allowing impurity removal while preventing the formation of deep pits and surface dents that would otherwise occur.
Solution Approach 2:
The patent uses parameter changes by specifying precise ranges for diffraction intensity ratios and crystal grain dimensions. These parameter controls modify the metal plate's response to etching, enabling effective impurity removal while maintaining surface uniformity and preventing excessive pit formation.
3Productivity
If through-holes are formed with varying depth and diameter, then manufacturing flexibility increases, but deposition efficiency decreases
Solution Approach 1:
The patent applies parameter changes by establishing specific ranges for crystal grain area (60-700 μm²) and diameter (2-30 μm), along with diffraction intensity ratios. These parameter specifications ensure that etching produces through-holes with uniform depth and diameter, maximizing deposition efficiency while avoiding the need for complex post-processing to correct non-uniformities.
4Manufacturing precision
If crystal grain size is reduced to minimize surface pits, then etching uniformity improves, but manufacturing difficulty increases
Solution Approach 1:
The patent applies parameter changes by defining specific ranges for crystal grain parameters (area: 60-700 μm², diameter: 2-30 μm) and diffraction intensity ratios. These parameter specifications achieve uniform etching and minimize surface pits while remaining practically achievable through standard metal processing techniques, balancing manufacturing precision with ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes surface defects, enhances deposition efficiency, and prevents deposition failures by ensuring uniformity in through-hole formation, thereby improving the overall quality of the deposition mask.
Implementation Method 1
diffraction intensity of a (111) plane of the alloy metal plate is defined as I (111), diffraction intensity of a (200) plane of the alloy metal plate is defined as I (200), diffraction intensity of a (220) plane of the alloy metal plate is defined as I (220)
Data Source
AI summary
In an alloy metal plate according to an embodiment, diffraction intensity of a (111) plane of the alloy metal plate is defined as I (111), diffraction intensity of a (200) plane of the alloy metal plate is defined as I (200), diffraction intensity of a (220) plane of the alloy metal plate is defined as I (220), a diffraction intensity ratio of I (200) is defined by the following Equation 1, and a diffraction intensity ratio of I (220) is defined by the following Equation 2. At this time, the A is 0.5 to 0.6, the B is 0.3 to 0.5, and the value A may be larger than a value B.A=I(200)/{I(200)+I(220)+I(111)}[Equation 1]The diffraction intensity ratio of I (220) is defined by the following Equation 2.B=I(220)/{I(200)+I(220)+I(111)}[Equation 2]In addition, in an iron (Fe)-nickel (Ni) alloy metal plate of a deposition mask for OLED pixel deposition according to an embodiment, the metal plate is formed of a plurality of crystal grains, and the maximum area of the crystal grains measured over the entire area of the metal plate is 700 μm2 or less.