Controlled-Viscosity Resin Mixture for Anisotropic Conductive Adhesives
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Solution Overview
Problem
Existing anisotropic conductive adhesives face issues with adhesive resin viscosity that either cause leakage or inhibit proper positioning of solder particles between substrate terminals, leading to weakened adhesion and increased contact resistance.
Innovation Solution
A self-assembling anisotropic conductive adhesive with a controlled fluidity range, utilizing a mixture of first and second epoxy resins with specific viscosity and molecular weight ranges, along with low-melting-point solder particles, to ensure proper positioning and adhesion between substrate terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the viscosity of the adhesive resin is too low, then the fluidity is improved allowing easier positioning, but the solder particles and adhesive resin leak out between the metal terminals
Solution Approach 1:
The patent controls the viscosity of the adhesive resin within a specific range (50-500 cP at 25°C) to optimize the balance between fluidity and leakage prevention. This parameter optimization allows the adhesive to flow sufficiently for proper positioning while maintaining enough viscosity to prevent excessive leakage during the component mounting process.
2Loss of substance
If the viscosity of the adhesive resin is too high, then the leakage is prevented, but the fluidity of the adhesive resin and solder particles is inhibited preventing proper positioning
Solution Approach 1:
The patent specifies a controlled viscosity range (50-500 cP at 25°C) for the adhesive resin to ensure sufficient fluidity for self-assembly while preventing excessive leakage. This parameter optimization resolves the contradiction by finding the optimal viscosity window that balances both requirements.
3Manufacturing precision
If the adhesive resin viscosity is not properly controlled, then the positioning of solder particles and adhesive resin between metal terminals is compromised, but controlling viscosity adds process complexity
Solution Approach 1:
The patent establishes a specific viscosity range (50-500 cP at 25°C) for the adhesive resin to ensure proper positioning of solder particles and adhesive resin between metal terminals. By defining this parameter range upfront in the material formulation, the patent avoids the need for complex real-time viscosity control processes during manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive achieves optimal adhesion and low contact resistance by maintaining the adhesive resin and solder particles between substrate terminals, enhancing the stability and reliability of the bonding process.
Implementation Method 1
a second epoxy resin having a viscosity of 100 cps or more and 500 cps or less
Implementation Method 2
a first epoxy resin including a plurality of epoxy groups in a molecule
Data Source
AI summary
An embodiment provides an adhesive resin mixture having controlled fluidity, and a self-assembling anisotropic conductive adhesive comprising the adhesive resin mixture. The self-assembling anisotropic conductive adhesive comprising the adhesive resin mixture having controlled fluidity provides excellent contact resistance while also providing superior adhesion compared to that provided by conventional adhesives.