Controller Chip Thermal Path Using a High-Conductivity Dummy Chip
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Solution Overview
Problem
High-speed operation in semiconductor devices leads to significant temperature increases in control circuits, which are not effectively managed by existing technologies, potentially reducing device performance through thermal throttling.
Innovation Solution
Incorporating a dummy chip with high thermal conductivity into the semiconductor device configuration, connected via wirings to both the controller chip and the printed circuit board, to enhance heat dissipation and prevent temperature rises.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the operation speed of the control circuit is increased, then the processing performance is improved, but the temperature of the control circuit is significantly increased
Solution Approach 1:
A dummy chip is introduced as an intermediary thermal management component between the controller chip and the heat dissipation structure. The dummy chip has a substrate made of material with higher thermal conductivity than the controller chip substrate, acting as a thermal bridge to efficiently conduct heat away from the control circuit while maintaining electrical isolation.
Solution Approach 2:
The thermal conductivity parameter of the substrate material is changed by using a dummy chip substrate with higher thermal conductivity than the controller chip substrate. This parameter change enables more efficient heat conduction from the control circuit to the heat dissipation structure, resolving the temperature increase issue while maintaining high operation speed.
2Temperature
If a dummy chip with high thermal conductivity is added to the device, then heat dissipation is improved, but the device complexity is increased
Solution Approach 1:
The dummy chip is designed to serve multiple functions: it provides thermal conduction pathway for heat dissipation, maintains the electrical connection structure between controller chip and printed circuit board, and can potentially serve as a placeholder for future functional components. This multi-functionality reduces the overall device complexity by consolidating thermal management and electrical connection functions.
Solution Approach 2:
The dummy chip replicates the basic chip structure and connection interface of the controller chip, allowing it to be integrated into the existing device architecture without requiring fundamental design changes. By copying the structural form while changing the material properties (higher thermal conductivity), the patent achieves heat dissipation improvement with minimal increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from the controller chip, preventing temperature increases and maintaining high operational performance by utilizing the high thermal conductivity of the dummy chip and its large surface area for improved heat transfer.
Implementation Method 1
a dummy chip having a component that has a higher thermal conductivity than a substrate of the second chip
Data Source
AI summary
A semiconductor device includes a printed circuit board having a plurality of first electrode pads on a first main surface and a plurality of second electrode pads electrically connected to at least one of the plurality of first electrode pads on a second main surface, a first chip disposed on the first main surface and having a non-volatile memory; a second chip having a third electrode pad and a control circuit configured to control an operation of the non-volatile memory, a dummy chip having a component that has a higher thermal conductivity than a substrate of the second chip, and a sealing member sealing the first, second, and dummy chips. The third electrode pad is connected to the component of the dummy chip via a first wiring, and the component of the dummy chip is connected to one of the plurality of first electrode pads via a second wiring.