Controller Memory Buffer Sharing for Multi-Chip Reliability

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Solution Overview

Problem

Conventional semiconductor systems require more memory buffers than memory chips, leading to increased area and reduced efficiency due to the need for extra buffers to handle programming failures, which complicates data communication and storage operations.

Innovation Solution

A semiconductor system with a controller having only two memory buffers that alternately and sequentially communicate with multiple memory chips, allowing immediate update and storage of new data regardless of programming success, reducing the need for multiple buffers and enhancing reprogram operations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If extra memory buffers are provided to handle programming failures, then reliability is improved, but device area increases

Engineering Contradiction:
Improveprogramming failure handlingVSAvoidcontroller area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges the functions of multiple dedicated memory buffers into a single shared memory buffer. Instead of having separate buffers for each memory chip (RAM0-RAM4 in conventional design), the invention uses one common buffer that is time-division multiplexed across all chips, thereby reducing controller area while maintaining the ability to handle programming failures through sequential retransmission

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The single memory buffer in the controller is designed to serve multiple functions: it acts as a data buffer for current programming operations and simultaneously serves as a retransmission buffer for handling programming failures. This multi-functional design eliminates the need for separate extra buffers dedicated solely to failure recovery, reducing overall area while improving reliability

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If more memory buffers are used to communicate with multiple memory chips, then reliability is improved, but device complexity increases

Engineering Contradiction:
Improvedata communication reliabilityVSAvoidcontroller structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple buffer resources into a single unified buffer structure, reducing the complexity of managing multiple separate buffers. The controller structure is simplified by eliminating the need for multiple buffer address decoders and control logic associated with RAM0-RAM4, while reliability is maintained through a centralized buffer management mechanism that coordinates data transmission and retransmission

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If extra memory buffers are provided for retransmission, then reliability is improved, but manufacturing cost increases

Engineering Contradiction:
Improvereprogram operation reliabilityVSAvoidcontroller manufacturing
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

By merging multiple buffer resources into a single buffer, the patent reduces the total transistor count, memory cell count, and interconnect resources required in the controller. This consolidation directly lowers manufacturing costs through reduced silicon area and simplified fabrication processes, while the single buffer is designed with enhanced functionality to handle both normal and failure recovery operations

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS9026762B2Semiconductor system including a controller having reduced number of memory buffers for transmitting data to a plurality of memory chips
Publication Date: 2015.05.05 SK HYNIX INC
  • US9026762B2 patent drawing
  • US9026762B2 patent drawing
  • US9026762B2 patent drawing

AI summary

A semiconductor system includes three or more memory chips and a controller with first and second memory buffers configured to communicate with the three or more memory chips. The first and second memory buffers alternately transmit data to sequentially communicate with the three or more memory chips.