Inwardly Converging Leadfingers for Diverse Connection Pitches
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Solution Overview
Problem
Current integrated circuit packaging technologies face challenges in accommodating high-speed devices, particularly in achieving smaller footprints, improved reliability, and cost-effectiveness, while addressing issues like increasing clock rates, EMI radiation, thermal loads, and assembly complexity, which are exacerbated by the need for precision and automation in manufacturing.
Innovation Solution
The use of inwardly converging leadfingers with continuously decreasing widths for attaching integrated circuit devices, allowing for diverse connection pitches and encapsulation with solder-capture-trenches to enhance versatility and reduce costs by enabling a single leadframe to support multiple applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional leadframes with uniform width leadfingers are used, then manufacturing is simple, but adaptability to diverse connection pitches is limited
Solution Approach 1:
The leadfingers are designed with continuously varying width along their length, creating different local geometries that accommodate diverse connection pitches. Each portion of the leadfinger has a specific width optimized for its intended connection point, allowing a single leadframe to support multiple pitch requirements without requiring multiple different leadframe designs.
2Adaptability or versatility
If multiple leadframe designs are used to support diverse connection pitches, then adaptability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The leadframe is designed as a universal component with leadfingers that can accommodate multiple connection pitches and various integrated circuit device configurations. The continuously varying width geometry enables the same leadframe to be used across different applications and device types, eliminating the need for multiple specialized leadframe designs and simplifying manufacturing inventories and processes.
Solution Approach 2:
Multiple leadframe designs with different pitch configurations are merged into a single unified leadframe design. The leadfingers incorporate a continuous width variation that integrates the functionality of what would otherwise require separate leadframe variants, consolidating multiple applications into one manufacturable component.
3Ease of operation
If leadfingers have constant width, then manufacturing is easier, but flexibility for diverse connections is reduced
Solution Approach 1:
The leadfinger width is intentionally varied along its length to provide different connection capabilities at different locations. This local quality variation allows the leadfinger to interface with diverse connection types and pitches while maintaining manufacturing feasibility through continuous, gradual width transitions that can be produced with standard manufacturing tolerances.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing inwardly converging leadfingers having continuously decreasing widths along lengths thereof to inward ends thereof; electrically connecting an integrated circuit device on the leadfingers only on portions of the continuously decreasing widths; and encapsulating the integrated circuit device and the leadfingers with an encapsulation.