Conversion Board for Chip Testing Signal Transfer
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Solution Overview
Problem
Current methods require significant time and resources for modifying hardware and software when testing chips on different models of testing jigs, leading to inefficiencies and increased costs due to the need for redesigning load boards, probe cards, and programming.
Innovation Solution
A device interface board with specified and public signal areas allows for the transfer of test signals between different testing jigs, eliminating the need for hardware and software modifications by enabling direct electrical connection and signal transfer between probe cards and testing jigs, including power, test input, and output signals, and addressing RF signal distortion through parallel connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chips are tested on different models of testing jigs, then production capacity can be increased, but hardware and software modifications are required which increases time and cost
Solution Approach 1:
A conversion board is introduced as an intermediary device between the testing jig and the chip under test. The conversion board includes a first interface that connects to the testing jig and a second interface that connects to the chip, serving as a mediator that adapts the testing jig's interface to match different chip requirements without modifying the testing jig itself.
Solution Approach 2:
The testing system is segmented into three independent components: the testing jig, the conversion board, and the chip under test. The conversion board acts as a separate, interchangeable module that can be changed depending on the chip model, while the testing jig remains unchanged. This segmentation allows the testing jig to maintain its original configuration while supporting multiple chip types.
2Adaptability or versatility
If hardware and software modifications are made to accommodate different testing jigs, then compatibility is achieved, but cost increases
Solution Approach 1:
The conversion board serves as a cost-effective intermediary that provides the necessary interface adaptations. Instead of modifying expensive testing jigs or creating custom probe cards for each chip model, the conversion board absorbs the cost of adaptation by providing model-specific interface configurations that work with the existing testing jig infrastructure.
Solution Approach 2:
Rather than creating entirely new probe cards for each chip model, the invention uses conversion boards that copy and adapt the interface requirements of different chip models to work with a standard testing jig. This approach reduces manufacturing costs by reusing the same testing jig hardware while implementing software and interface adaptations through the conversion board.
3Reliability
If probe cards and load boards are redesigned for different testing jigs, then testing capability is optimized, but time consumption increases
Solution Approach 1:
The testing system is divided into stable components (testing jig) and variable components (conversion board). The conversion board is segmented with specific wiring areas and public signal areas that can be configured for different chip models, allowing rapid reconfiguration without affecting the stable testing jig infrastructure.
Solution Approach 2:
The conversion board is designed with universal public signal areas that remain consistent across different chip models, while specific wiring areas can be configured for different models. This multi-functionality allows a single conversion board design to support multiple chip types through configurable wiring, eliminating the need to redesign entire probe cards for each model.
Data Source
AI summary
The invention relates to a device interface board for testing chips, which is cooperatively installed with one of a plurality of probe cards. Each of the plurality of probe cards is provided with a specified wiring area and a first public signal area, the specified wiring area being electrically connected with the first public signal area. The first public signal area of each of the plurality of probe cards is located in a same particular area, and the specified wiring area of each of the plurality of probe cards is electrically connected with a testing jig and is different depending on a different testing jig. The device interface board comprises a chip test area and a second public signal area, in which the chip test area is used to carry a chip under test and is electrically connected with the second public signal area, whereby, through electrical connection between the device interface board and the first public signal area of each of the plurality of probe cards, test signals are transferred between the testing jig and the chip under test, and testing of chips under test having the same model are accomplished between different testing jigs.