Conversion-Medium Lamina for LED Thermal and Optical Management
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Solution Overview
Problem
Existing optoelectronic semiconductor components face challenges in efficiently converting primary radiation into secondary radiation with a higher wavelength, particularly in achieving high packing density of conversion-medium particles and maintaining thermal contact, while also ensuring color locus control and mechanical integrity.
Innovation Solution
A conversion-medium lamina is designed with a matrix material and closely packed conversion-medium particles, where the particles are embedded in a conversion layer closest to the semiconductor chip and a binder layer further away, allowing for efficient production methods like electrophoresis and sedimentation, and optionally including diffusion-medium particles for improved heat dissipation and mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conversion-medium particles are closely packed to achieve high packing density, then conversion efficiency is improved, but thermal contact and heat dissipation become insufficient
Solution Approach 1:
The patent applies local quality by creating different regions within the conversion layer: a first conversion layer with high particle packing density (≥50% by volume) for optimal conversion efficiency, and a second conversion layer with lower particle packing density for improved thermal contact and heat dissipation. This spatial variation in particle density allows simultaneous optimization of both conversion efficiency and thermal management in different locations of the same component.
2Productivity
If conversion-medium particles are closely packed, then conversion efficiency is improved, but mechanical integrity and structural stability deteriorate
Solution Approach 1:
The patent employs composite materials by combining conversion-medium particles with a matrix material in the conversion layer. The matrix material provides mechanical support and structural stability to the closely packed particles, preventing particle displacement and maintaining mechanical integrity while allowing high particle packing density (≥50% by volume) for efficient radiation conversion.
3Productivity
If conversion-medium particles are used with high proportion, then conversion efficiency is improved, but color locus control becomes difficult
Solution Approach 1:
The patent applies segmentation by dividing the conversion layer into multiple distinct layers (first conversion layer and second conversion layer), each with different particle packing densities and potentially different conversion-medium particle compositions. This layered structure enables independent optimization of conversion efficiency in the first layer and color locus control in the second layer, resolving the contradiction between high particle proportion and precise color control.
4Productivity
If conversion-medium particles are closely packed, then conversion efficiency is improved, but ease of manufacture deteriorates
Solution Approach 1:
The patent applies preliminary action by pre-forming the conversion layer with the specific particle packing density distribution (≥50% in first layer, lower in second layer) during the manufacturing process. This predetermined structure allows subsequent assembly steps to proceed without complex adjustments, maintaining ease of manufacture while achieving high conversion efficiency through the optimized particle arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective conversion of primary radiation into secondary radiation with a higher wavelength, achieving high packing density and thermal contact, while ensuring mechanical integrity and color locus control, thereby enhancing the performance and longevity of optoelectronic semiconductor components.
Implementation Method 1
The conversion-medium particles are designed for converting a primary radiation into a secondary radiation with a higher wavelength
Implementation Method 2
Methods mentioned for producing a conversion-medium lamina include electrophoresis and sedimentation
Data Source
AI summary
In at least one embodiment, the semiconductor component includes an optoelectronic semiconductors chip. Furthermore, the semiconductor component includes a conversion-medium lamina, which is fitted to a main radiation side of the semiconductor chip and is designed for converting a primary radiation into a secondary radiation. The conversion-medium lamina includes a matrix material and conversion-medium particles embedded therein. Furthermore, the conversion-medium lamina includes a conversion layer. The conversion-medium particles are situated in the at least one conversion layer. The conversion-medium particles, alone or together with diffusion-medium particles optionally present, make up a proportion by volume of at least 50% of the conversion layer. Furthermore, the conversion-medium lamina includes a binder layer containing the conversion-medium particles with a proportion by volume of at most 2.5%.