Traction Converter Cooler With Variable Pitch Heat Radiation Fins
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Solution Overview
Problem
Existing traction converters for electric railway vehicles face inefficiencies in cooling semiconductor elements due to uneven temperature distribution, leading to reduced conversion efficiency and potential element breakdown, with existing coolers being either heavy, costly, or ineffective at temperature equalization.
Innovation Solution
A traction converter design featuring a cooler with heat radiation fins arranged in specific regions (up-wind, mid-wind, and down-wind) with optimized surface areas and configurations to promote even heat transfer and temperature equalization, utilizing heat pipes and fins to efficiently radiate heat from semiconductor elements to outside air.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If heat radiation fins are uniformly distributed across all regions, then manufacturing is simple, but temperature equalization among semiconductor elements deteriorates
Solution Approach 1:
The patent applies local quality by dividing the heat radiation fins into three distinct groups (first, second, and third groups) with different pitches along the wind direction. The first group has a larger pitch to reduce resistance for incoming cooling wind, the second group has a medium pitch for balanced heat radiation, and the third group has a smaller pitch to enhance heat radiation efficiency where cooling wind is already established. This localized differentiation optimizes temperature equalization across semiconductor elements while maintaining manufacturing feasibility through systematic variation rather than complete uniformity.
2Temperature
If heat radiation fins with small pitch are used throughout, then heat radiation efficiency improves, but cooling wind resistance increases and device weight increases
Solution Approach 1:
The patent applies parameter changes by systematically varying the pitch parameter of heat radiation fins across different groups and positions. The pitch is not fixed but changes according to the group (first, second, third) and the specific fin position within each group. This parameter variation allows the system to achieve high heat radiation efficiency where needed (smaller pitch in third group) while reducing overall weight and resistance (larger pitch in first group), optimizing the trade-off between heat radiation performance and device weight.
3Temperature
If more heat radiation fins are added to increase cooling capacity, then heat radiation area increases, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent applies segmentation by dividing the heat radiation fins into three distinct groups along the wind direction, with each group serving a specific functional purpose. This segmentation allows the system to achieve comprehensive cooling coverage through a structured approach rather than simply adding more fins uniformly. The segmented design with varying pitches in different groups optimizes cooling capacity while controlling structural complexity through systematic organization.
4Temperature
If heat pipes are inclined with evaporation part below condensation part, then heat transport efficiency improves, but mounting space requirements increase
Solution Approach 1:
The patent applies asymmetry by configuring the heat pipes with an inclined orientation where the evaporation part is positioned below the condensation part. This asymmetric arrangement exploits gravity-assisted heat transport to improve heat transfer efficiency from the semiconductor elements upward to the heat radiation fins. The inclined asymmetric design optimizes thermal performance while accommodating the necessary vertical space within the constrained mounting environment under the vehicle floor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively equalizes semiconductor element temperatures, enhancing cooling efficiency while maintaining a lightweight configuration, reducing production costs, and achieving equivalent or improved cooling performance compared to existing solutions.
Implementation Method 1
The heat pipe, in which coolant such as pure water is encapsulated in the interior, is a device to efficiently transport heat in a cycle in which the coolant is evaporated at a heat receiving part and the heat is transported to a heat radiation part, then the coolant is condensed at the heat radiation part and is returned to the heat receiving part.
Implementation Method 2
the coolant is evaporated at a heat receiving part and the heat is transported to a heat radiation part
Implementation Method 3
the coolant is condensed at the heat radiation part and is returned to the heat receiving part
Implementation Method 4
plural heat radiation fins that are provided roughly vertically and that radiate the heat by the natural convection cooling to the air
Implementation Method 5
a heat radiation fin group arranged at the up-wind side of the cooling wind has a larger fin pitch than the fin pitch of a heat radiation fin group arranged at the down-wind side of the cooling wind
Data Source
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AI summary
The present invention equalizes the temperatures of semiconductor elements and efficiently cools the semiconductor elements in a lightweight device configuration, by optimally combining the configurations of heat radiation fins in accordance with the configuration of the semiconductor elements. A traction converter includes plural semiconductor elements included in a traction converting circuit and a cooler to radiate heat from the plural semiconductor elements to outside air, the cooler including a heat receiving block, plural heat pipes and plural heat radiation fins, the plural semiconductor elements being arrayed on one surface of the heat receiving block, heat receiving parts of the plural heat pipes being buried in the opposite surface of the heat receiving block, heat radiation parts of the plural heat pipes being erectly provided so as to protrude from the heat receiving block, the plural heat radiation fins being joined to the heat radiation parts. In the cooler, three semiconductor elements are provided in a cooling wind flow direction, and, when a region at which the plural heat radiation fins are provided is divided in the cooling wind flow direction into three of an up-wind region, a mid-wind region and a down-wind region, a heat radiation fin surface area at the up-wind region is in a range of 0.33 to 0.42 times of a heat radiation fin surface area at the down-wind region, and a heat radiation fin surface area at the mid-wind region is in a range of 0.42 to 0.63 times of the heat radiation fin surface area at the down-wind region.