Power Converter Cover Cooling Layout for Uniform Heat Dissipation
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Solution Overview
Problem
The existing power conversion devices face inefficiencies in heat dissipation due to varying heat generation rates among electronic components and their close arrangement in a narrow space, which traditional heat radiating fins fail to adequately address.
Innovation Solution
The power conversion device incorporates a housing with a cover featuring a plate portion, heat conduction portion, and refrigerant pipe, where the plate portion includes grooves for the refrigerant pipe, and the heat conduction portion is designed with inclined regions to enhance heat dissipation by uniformly radiating heat across a wide area through both heat radiating fins and the refrigerant pipe.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If only heat radiating fins are used for heat dissipation, then the structure remains simple, but heat dissipation efficiency is insufficient due to varying heat generation rates and narrow component arrangement
Solution Approach 1:
The heat dissipation system is segmented into multiple functional components: heat radiating fins for general heat dissipation, heat conduction portions for targeted heat transfer from high-heat components, and refrigerant pipes for active cooling. This segmentation allows each component to address specific heat generation patterns, resolving the contradiction between simplicity and effectiveness.
Solution Approach 2:
Different regions of the housing are assigned different heat dissipation qualities: areas with high-heat components (transformers, inductors) receive enhanced cooling through dedicated heat conduction portions and refrigerant pipes, while other areas use standard heat radiating fins. This local differentiation optimizes heat dissipation efficiency without uniformly increasing complexity throughout the entire device.
2Volume of moving object
If multiple electronic components are arranged in narrow space, then device compactness is improved, but heat dissipation becomes insufficient due to heat accumulation
Solution Approach 1:
The heat conduction portions are nested within the housing structure, with refrigerant pipes embedded in grooves of the heat conduction portions. This nested arrangement allows multiple heat dissipation functions to be integrated into a compact form factor, maintaining device compactness while providing sufficient heat dissipation capacity through multi-layered cooling mechanisms.
Solution Approach 2:
Heat conduction portions act as intermediaries between heat-generating components and the refrigerant pipes or heat radiating fins. These intermediary structures efficiently transfer heat from concentrated sources to broader dissipation areas, enabling compact component arrangement while preventing heat accumulation through effective thermal bridging.
3Temperature
If heat radiating fins are used, then some heat dissipation is achieved, but uniform heat distribution across wide area is not accomplished
Solution Approach 1:
The refrigerant pipes are arranged in three-dimensional grooves within the heat conduction portions, creating a multi-dimensional heat dissipation network. This dimensional arrangement allows heat to be distributed uniformly across a wider area by utilizing vertical and horizontal pathways, transforming the two-dimensional heat radiation of simple fins into a three-dimensional heat management system.
Solution Approach 2:
Heat conduction portions are positioned in advance to contact or proximity with heat-generating components before heat accumulation occurs. This preliminary positioning ensures that heat is intercepted and redistributed uniformly across the housing structure before localized hot spots can form, achieving uniform heat distribution proactively rather than reactively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat radiation efficiency by ensuring uniform heat distribution across a broader area, effectively managing heat generated by multiple components within the device.
Implementation Method 1
a heat conduction portion (160) coupled with the lower surface of the plate portion (121)
Implementation Method 2
Heat dissipation of the housing may be achieved through heat radiating fins disposed on the outer surface of the housing. The heat radiating fins are formed by being protruded from the outer surface of the housing, whereby heat generated in the housing can be radiated to the outside.
Implementation Method 3
a refrigerant pipe (170), wherein the plate portion (121) includes a first groove (124) in which the refrigerant pipe (170) is disposed
Data Source
AI summary
A power conversion device includes: a housing; and a cover coupled to the housing, the cover includes a plate portion, a heat conduction portion coupled to the plate portion, and a refrigerant pipe, the plate portion includes a first groove in which the refrigerant pipe is disposed, and the depth of one end of the first groove is smaller than that of the other end.