High-Conductivity Converter Element for LED Heat Dissipation
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Solution Overview
Problem
Existing optoelectronic converter elements for surface-emitting semiconductor lasers and LEDs face challenges in efficiently managing heat and optimizing light conversion, leading to reduced service life and luminance.
Innovation Solution
An optoelectronic converter element with a carrier material of high thermal conductivity (>25 W/(m*K)) and phosphor regions, optionally with a reflective layer, is designed to efficiently dissipate heat and convert electromagnetic radiation, featuring a structured arrangement of converter areas corresponding to light-emitting elements for enhanced light output and reduced heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional carrier materials with low thermal conductivity are used, then manufacturing cost is reduced, but heat dissipation efficiency deteriorates leading to reduced service life and luminance
Solution Approach 1:
The patent changes the thermal conductivity parameter of the carrier material from conventional low values to greater than 25 W/(m*K), specifically using materials like aluminum nitride or diamond. This parameter change enables efficient heat dissipation while maintaining structural integrity, directly resolving the contradiction between heat dissipation efficiency and service life.
Solution Approach 2:
The patent employs composite structures combining high thermal conductivity carrier materials with phosphor layers and reflective layers. This composite approach optimizes both thermal management and optical conversion efficiency, improving reliability without sacrificing performance.
2Temperature
If high thermal conductivity carrier material is used, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the converter element into distinct functional layers: a high thermal conductivity carrier, phosphor layers, and reflective layers. This segmentation allows each layer to be optimized independently for its specific function while simplifying the overall manufacturing process through modular assembly.
Solution Approach 2:
The patent applies high thermal conductivity material specifically where heat dissipation is most critical (the carrier), while other layers focus on optical functions. This local optimization reduces overall manufacturing complexity by assigning specific material properties to specific functional requirements.
3Device complexity
If conventional non-reflective carrier materials are used, then device simplicity is maintained, but light conversion efficiency deteriorates
Solution Approach 1:
The patent makes the carrier material serve multiple functions: structural support, heat dissipation, and light reflection. By selecting materials like aluminum nitride or diamond with inherently high reflectivity, the carrier becomes a multi-functional component, improving light conversion efficiency without significantly increasing device complexity.
4Illumination intensity
If higher current and power operation is implemented, then luminance is improved, but heat-related degradation increases
Solution Approach 1:
The patent converts the harmful heat generated by high-power operation into a manageable parameter by using the high thermal conductivity carrier to efficiently dissipate it. The heat that would normally cause degradation is instead channeled away through the carrier, enabling sustained high-luminance operation without compromising reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces heat-related issues, allowing for higher current and power operation without degradation, extending the service life and achieving improved luminance and compact design suitable for high-luminance applications.
Implementation Method 1
a carrier (110) comprising a material having a thermal conductivity greater than 25 W/(m*K)
Implementation Method 2
a phosphor (115) disposed in the openings (112)
Implementation Method 3
the material of the carrier (110) can be reflective... have a reflectivity for radiation converted by the converter element of at least 75%, at least 80% or at least 90%
Data Source
AI summary
An optoelectronic converter element includes a substrate, which includes a material having a thermal conductivity of greater 25 W/(m*K), openings being formed in the substrate, and a luminophore located in the openings, thereby defining converter regions.