Current Converter Fault Isolation for Partial-Load Operation
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Solution Overview
Problem
Electronic modules with semiconductor elements, such as converters and inverters, typically fail if one semiconductor element is defective, leading to significant downtime costs due to the inability to maintain operation.
Innovation Solution
A method where at least two remaining semiconductor elements are selectively activated to destroy or open-circuit the defective element by distributing current through them, allowing the module to continue operating in partial load mode by selectively activating corresponding semiconductor elements in other half-bridges to ensure complete destruction or open-circuiting of the defective element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the module operates with all semiconductor elements, then full power and capacity are achieved, but the system fails completely when one element is defective
Solution Approach 1:
The patent applies partial action by activating only the healthy semiconductor elements when a defect is detected, rather than shutting down the entire module. This allows the converter to continue operating at reduced capacity (partial load mode) with the remaining functional elements, maintaining reliability while accepting reduced productivity.
Solution Approach 2:
The control device changes the operational parameters of the semiconductor elements by selectively deactivating defective elements and redistributing the operational load to healthy elements. This parameter change enables the system to transition from full-power operation to reduced-capacity operation, resolving the contradiction between reliability and productivity.
2Reliability
If the defective semiconductor element is destroyed by current, then operational continuity is achieved, but the remaining elements experience increased stress
Solution Approach 1:
The patent rushes through the defect elimination process by applying a controlled destructive current pulse to the defective semiconductor element to quickly open-circuit it and remove it from service. This rapid action eliminates the defect source before it can cause further damage, prioritizing reliability over the durability of the individual defective element.
Solution Approach 2:
The patent converts the harmful effect of the defective element into a beneficial outcome by using controlled current to destroy the defective element's weak point (such as a bond wire). This intentional destruction eliminates the defect and allows the module to continue operating, transforming a potential failure into a recovery mechanism.
3Reliability
If parallel connection with multiple switching branches is used, then fault tolerance is improved, but device complexity increases
Solution Approach 1:
The patent segments the converter circuit into multiple independent half-bridges, each with its own semiconductor elements. This segmentation allows one defective element to be isolated and destroyed without affecting the other half-bridges, enabling fault tolerance while maintaining a relatively simple overall structure compared to fully redundant parallel systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the electronic module to continue operating, albeit at reduced capacity, by selectively destroying or open-circuiting defective semiconductor elements, thereby minimizing downtime and maintaining partial functionality.
Implementation Method 1
a current is passed via the defective semiconductor element by selectively activating at least two of the remaining semiconductor elements in order to destroy or open-circuit the defective semiconductor element
Data Source
AI summary
A method for operating an electronic module which includes at least three semiconductor elements is disclosed. In the event of a defect of one of the semiconductor elements, by targeted control of at least two of the other semiconductor elements, a current is conducted via the defective semiconductor element in order to destroy or disconnect the defective semiconductor element or a weak point associated with the defective semiconductor element. This current is distributed to the semiconductor elements which are controlled in a targeted manner.