3-Level Power Converter Low Inductance Connection Design
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Solution Overview
Problem
Conventional 3-level converter devices experience high effective parasitic inductance during commutation processes, leading to high switching overvoltages and reduced switching speed and frequency of power semiconductor switches.
Innovation Solution
The design features power semiconductor components with flat-shaped connection elements arranged in specific spatial orientations to facilitate low-inductance electrical connections between 3-level converter devices, including parallel and stacked configurations, and the use of conductive and non-conductive clamp elements to reduce eddy currents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrical connections are used to connect 3-level converter devices, then the devices can be electrically connected, but high effective parasitic inductance occurs during commutation processes, resulting in high switching overvoltages and reduced switching speed and frequency
Solution Approach 1:
The connection elements are arranged in a three-dimensional spatial configuration with specific orientations (first spatial direction for protrusion, second spatial direction for sequential arrangement, third spatial direction for vertical stacking). This dimensional arrangement minimizes the loop area and optimizes the current path, thereby reducing effective parasitic inductance during commutation processes while maintaining reliable electrical connections.
2Productivity
If standard connection designs are used, then manufacturing is simplified, but switching overvoltages increase and switching speed decreases
Solution Approach 1:
The connection elements have specific local spatial orientations and arrangements optimized for their function. The first and second neutral voltage potential connection elements are sequentially arranged in the second spatial direction, while the direct voltage potential connection elements are arranged in the third spatial direction. This localized optimization of connection geometry minimizes parasitic inductance at critical commutation points, enabling higher switching frequencies without requiring complete redesign of the entire device.
3Speed
If connection elements are arranged to reduce inductance, then switching speed improves, but the spatial arrangement becomes more complex
Solution Approach 1:
The patent utilizes three-dimensional spatial arrangement to optimize connection geometry. Connection elements protrude in the first spatial direction, are sequentially arranged in the second spatial direction, and are vertically stacked in the third spatial direction. This multi-dimensional configuration minimizes the current loop area and parasitic inductance, enabling faster switching speeds while maintaining a structured and manufacturable spatial arrangement.
Data Source
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AI summary
The invention relates to a 3-level power converter device with power semiconductor components, wherein the 3-level power converter device has for electrical contacting a first DC positive potential connection element, a first DC negative potential connection element and a first and a second neutral potential connection element, wherein the first and the second neutral potential connection element are electrically connected to each other, wherein the first DC positive potential connection element and the first neutral potential connection element form a first connection element pair, and the second neutral potential connection element and the first DC negative potential connection element form a second connection element pair, wherein the first and the second connection element pair are arranged one after the other in a second spatial direction.wherein the first DC positive potential connection element and the first neutral potential connection element are arranged one above the other in a third spatial direction, and the second neutral potential connection element and the first DC negative potential connection element are arranged one above the other in a third spatial direction. The invention provides a 3-level power converter device that can be electrically connected with low inductance to another 3-level power converter device.