Power Converter PCB Layout for Replaceable Capacitor Connections

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Solution Overview

Problem

In conventional power conversion devices, capacitors are mounted on a separate substrate from semiconductor elements, leading to potential connection failures due to stress on the connector, making capacitor replacement difficult and prone to connection issues.

Innovation Solution

A power conversion device with a printed circuit board where capacitors are sandwiched between input-side and output-side semiconductor modules, supported by both modules for easy detachment and reduced stress, minimizing connection failures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of repair

If the capacitor is mounted on a separate substrate from the semiconductor elements, then the capacitor replacement becomes easier, but the connection reliability deteriorates due to stress on the connector

Engineering Contradiction:
Improvecapacitor replacementVSAvoidconnection reliability
Core Design Contradiction:
Ease of repairVSReliability

Solution Approach 1:

The patent merges the capacitor substrate and semiconductor element substrate into a single integrated substrate. The capacitor is mounted on the same substrate as the input-side and output-side semiconductor elements, eliminating the need for a separate capacitor substrate and connector. This integration maintains connection reliability by removing the stress-prone connector interface while still allowing capacitor replacement through standard electronic component replacement procedures.

Inventive Principle:
Principle #5Merging (Combining)

2Adaptability or versatility

If the capacitor substrate is supported via a connector in a cantilever state, then the capacitor can be mounted on a separate substrate, but stress is applied to the connection portion causing connection failures

Engineering Contradiction:
Improveseparate substrate mountingVSAvoidconnection strength
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The patent combines the capacitor substrate and semiconductor element substrate into one unified substrate structure. This eliminates the cantilever configuration and connector interface that cause stress concentration. The capacitor, semiconductor elements, and their interconnections all reside on the same substrate, providing structural integrity and eliminating the weakness of separate substrate mounting while maintaining the ability to replace the capacitor independently.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20260032846A1Power conversion device
Publication Date: 2026.01.29 MITSUBISHI ELECTRIC CORP
  • US20260032846A1 patent drawing
  • US20260032846A1 patent drawing
  • US20260032846A1 patent drawing

AI summary

Provided is a power conversion device in which replacement of a capacitor is easy and a connection failure is unlikely to occur between the capacitor and an electronic component. The power conversion device includes: a printed circuit board having a first surface; at least one capacitor mounted on the first surface of the printed circuit board; and an input-side semiconductor module and an output-side semiconductor module disposed to sandwich the at least one capacitor in a first direction along the first surface and electrically connected to each other via the at least one capacitor. The printed circuit board is detachably supported by each of the input-side semiconductor module and the output-side semiconductor module.