Electric Power Converter Segmented Pressure Control
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Solution Overview
Problem
In electric power converters, the uniform pressure applied to both semiconductor modules and reactors for cooling can lead to excessive load on reactors, hindering miniaturization and weight reduction, and complicating thermal expansion and contraction, as the pressing force required for semiconductor cooling is not optimally controlled.
Innovation Solution
The electric power converter employs a main pressure member for semiconductor modules and a sub-pressure member for electronic components, with a supporting structure to isolate the pressing force from the semiconductor section, allowing controlled pressure on the reactor and ensuring sufficient contact pressure for efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a uniform pressing force is applied to both semiconductor modules and reactors, then sufficient cooling contact pressure is obtained for semiconductor modules, but excessive load is imposed on reactors causing increased size and weight
Solution Approach 1:
The pressing force application is segmented into two independent systems: a main pressure member for semiconductor modules and a sub-pressure member for reactors. This allows differential pressing forces to be applied to different components, optimizing cooling contact pressure for semiconductor modules while reducing unnecessary load on reactors, thereby preventing reactor size and weight increase.
Solution Approach 2:
Different pressing forces are applied to different components based on their specific cooling requirements. The main pressure member provides higher pressing force to semiconductor modules that require sufficient cooling contact pressure, while the sub-pressure member provides lower pressing force to reactors that do not require cooling, achieving local optimization of pressing force distribution.
2Temperature
If a uniform pressing force is applied to both semiconductor modules and reactors, then sufficient cooling contact pressure is obtained for semiconductor modules, but thermal expansion and contraction of reactors cannot be properly absorbed
Solution Approach 1:
The pressure member system is segmented into main and sub-pressure members with independent pressing forces. The sub-pressure member for reactors uses a spring mechanism that provides flexible, adaptive pressing force capable of absorbing thermal expansion and contraction of reactors, while the main pressure member for semiconductor modules provides stable, sufficient cooling contact pressure.
Solution Approach 2:
The pressing force parameter is changed differently for different components. The sub-pressure member for reactors uses a spring mechanism that allows the pressing force to vary dynamically to absorb thermal expansion and contraction, while the main pressure member for semiconductor modules maintains a higher, more stable pressing force for effective cooling.
3Weight of stationary object
If the pressing force on reactors is reduced for miniaturization, then reactor size and weight are reduced, but sufficient cooling contact pressure for semiconductor modules cannot be ensured
Solution Approach 1:
The pressing force system is segmented into two independent parts: the main pressure member that provides sufficient pressing force to semiconductor modules for effective cooling, and the sub-pressure member that provides reduced pressing force to reactors. This segmentation allows reactor size and weight to be reduced while ensuring semiconductor modules receive adequate cooling contact pressure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for effective cooling of semiconductor modules and reactors while preventing excessive pressure on reactors, facilitating miniaturization and weight reduction, and enabling efficient heat dissipation without increasing component size.
Implementation Method 1
a plurality of cooling tubes for cooling the semiconductor module and the electronic component by sandwiching them from both sides
Data Source
AI summary
An electric power converter includes a semiconductor module, an electronic component, a plurality of cooling tubes, a case, a main pressure member for pressing a stacked semiconductor section in a stacking direction, and a sub-pressure member for pressing a stacked component section in the stacking direction. The stacked semiconductor section and the stacked component section are stacked in line. A pressing force of the main pressure member is greater than a pressure pressing force of the sub-pressure member. The main pressure member is disposed at an end portion of the stacked component section far from the stacked semiconductor section. A supporting portion that supports the stacked semiconductor section from the stacked component section side is disposed in the case so as to prevent the pressing force of the main pressure member from acting on the stacked component section.