Power Converter Shielding Planes for EMI Control
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Solution Overview
Problem
Power converter modules face challenges in operating at high frequencies and slew rates due to electromagnetic interference (EMI) from heat sinks, which can distort control signals and affect the output of power transistors.
Innovation Solution
Incorporating shielding planes between control IC chips and thermal pads to block EMI emanating from heat sinks, allowing the power converter modules to operate effectively at high frequencies and slew rates by preventing interference with control signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks are used for thermal management, then heat dissipation is improved, but electromagnetic interference increases
Solution Approach 1:
The patent introduces shielding planes as intermediary elements positioned between the heat sink and control IC chips. These shielding planes act as a mediator that blocks electromagnetic interference from the heat sink while allowing thermal management to continue, thus resolving the contradiction between heat dissipation and EMI prevention
Solution Approach 2:
The patent segments the module into distinct functional zones by introducing shielding planes that divide the space between the heat sink and control electronics. This segmentation separates the thermal management function from the control function, allowing each to operate independently without interfering with the other
2Reliability
If shielding planes are added to block EMI, then control signal integrity is improved, but device complexity increases
Solution Approach 1:
The patent merges the shielding planes with existing structural elements of the module, integrating EMI protection into the overall module design rather than adding completely separate components. This combining approach provides the necessary shielding while minimizing the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of shielding planes effectively curtails EMI, enabling power converter modules to operate at frequencies of at least 200 kilohertz and slew rates of 100 volts per nanosecond, ensuring proper operation and preventing distortion of control signals.
Implementation Method 1
shielding planes overlaying the first surface of the substrate. The shielding planes provide a first shielding plane situated between the thermal pad and the first control IC chip of the IC chips and a second shielding plane of the shielding planes situated between the thermal pad and a second control IC chip of the control IC chips
Implementation Method 2
A thermal pad is situated on the second surface of the substrate, and the thermal pad is configured to be thermally coupled to a heat sink
Data Source
AI summary
A power converter module includes power transistors and a substrate having a first surface and a second surface that opposes the first surface. A thermal pad is situated on the second surface of the substrate, and the thermal pad is configured to be thermally coupled to a heat sink. The power converter module also includes a control module mounted on a first surface of the substrate. The control module also includes control IC chips coupled to the power transistors. A first control IC chip controls a first switching level of the power converter module and a second control IC chip controls a second switching level of the power converter module. Shielding planes overlay the substrate. A first shielding plane is situated between the thermal pad and the first control IC chip and a second shielding plane is situated between the thermal pad and a second control IC chip.