Power Converter Substrate Cooling Layout for Low Inductance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electric power conversion devices face challenges in simultaneously achieving effective cooling and reducing inductance, particularly in high-temperature environments, which can lead to increased losses and thermal stress on semiconductor modules.
Innovation Solution
The device incorporates a substrate with main and sub-flow path holes that disperse electric current paths, a refrigerant-cooled heat radiation system, and parallel capacitor connections to reduce inductance and enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling system is added to cool the semiconductor module, then the cooling performance is improved, but the inductance increases and device complexity increases
Solution Approach 1:
The cooling system is merged with the DC power supply structure. The DC power supply serves dual functions: providing electrical power to the semiconductor module and acting as a heat dissipation component. The cooling channels are integrated within the DC power supply housing, eliminating the need for separate cooling components and reducing overall device complexity while maintaining effective cooling performance.
Solution Approach 2:
The DC power supply is designed with multi-functionality, serving both as an electrical power source and as a thermal management system. The same structural component (DC power supply) performs two essential functions: electrical power delivery and heat dissipation through integrated cooling channels, thereby reducing the total number of components needed in the system.
2Loss of energy
If the inductance is reduced to suppress temperature rising, then the loss is reduced, but the cooling performance may be compromised
Solution Approach 1:
The DC power supply structure is segmented to create multiple cooling channels that are distributed throughout the power supply housing. This segmentation allows the cooling system to effectively reach and cool multiple semiconductor modules simultaneously, ensuring adequate thermal management while maintaining low inductance design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for simultaneous reduction in inductance and improved cooling, enhancing the reliability and performance of the power conversion device in high-temperature conditions.
Implementation Method 1
a flow path of a refrigerant which cools the power module
Implementation Method 2
the refrigerant migrates from the first surface to the second surface, passing through the main flow path holes
Implementation Method 3
the plurality of main flow path holes is arranged at a position where they cross the DC path, and the refrigerant migrates from the first surface to the second surface, passing through the main flow path holes
Data Source
Figure 1
Figure 2
Figure 3
AI summary
This power conversion device comprises: a power module which converts direct current power into alternating current power; a substrate on which the power module is disposed and which includes a direct current path for transmitting the direct current power to the power module, the substrate having a first surface, a second surface directly facing the first surface, and a plurality of main flow path holes penetrating the second surface from the first surface; and a flow path forming body which forms at least a portion of the first surface and the second surface of the substrate so as to cover the plurality of main flow path holes, and which forms a flow path for a refrigerant that cools the power module, wherein the plurality of main flow path holes are disposed in position traversing the direct current path, and the refrigerant moves from the first surface to the second surface through the main flow path holes.