PCB Converter Housing With Thermal Interface Layers for Heat Dissipation
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Solution Overview
Problem
Existing converters face inefficiencies in heat dissipation within their housings, particularly when using refrigerant pipes, which do not adequately address the heat generated by electronic components.
Innovation Solution
A converter design featuring protruded parts on the housing surface to accommodate heat transfer layers with thermal interface material, allowing heat to be transferred in both directions, and incorporating a terminal groove to ensure smooth heat transfer from terminals to these layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a refrigerant pipe is disposed in the housing for heat dissipation, then heat dissipation function is provided, but heat dissipation efficiency is insufficient
Solution Approach 1:
The heat dissipation function is segmented into multiple independent heat transfer layers disposed at different locations (upper surface, lower surface, and side surfaces of the PCB) rather than relying on a single refrigerant pipe system. Each heat transfer layer independently contacts heat-generating components and transfers heat to the housing, thereby improving overall heat dissipation efficiency and reliability.
Solution Approach 2:
The patent transitions from a one-dimensional heat dissipation approach (single refrigerant pipe) to a multi-dimensional approach by disposing heat transfer layers on multiple surfaces (upper, lower, and side surfaces) of the PCB at different heights. This spatial distribution across multiple dimensions increases the total heat transfer area and improves heat dissipation performance.
2Adaptability or versatility
If electronic components are mounted on the PCB, then functional integration is achieved, but heat generation increases requiring improved heat dissipation
Solution Approach 1:
The heat dissipation system is segmented into multiple heat transfer layers positioned at different locations on the PCB (upper surface, lower surface, side surfaces). Each layer targets specific heat-generating components, allowing effective heat dissipation while maintaining high component integration density on the PCB.
Solution Approach 2:
Heat transfer layers are selectively disposed at specific locations where heat-generating components are mounted (e.g., near power modules, processors). This local quality approach ensures that heat dissipation resources are concentrated where most needed, effectively managing heat generation from integrated electronic components without compromising functional integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by increasing contact area and improving heat transfer through the use of thermal interface materials, ensuring effective heat dissipation from electronic components.
Implementation Method 1
a heat transfer layer filled with a thermal interface material is disposed in the terminal groove
Data Source
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AI summary
A converter comprises: a housing comprising a refrigerant flow path; a printed circuit board disposed on top of the housing and on the upper surface of which an electronic component is disposed; and a cover disposed on top of the printed circuit board and which covers the upper surface of the electronic component, wherein a heat transfer layer filled with a thermal interface material is disposed on the upper surface of the housing or the lower surface of the cover overlapping the electronic component in the vertical direction.