Converter Wire-Bond Test Circuit for Multi-Path Connectivity Checks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing automated test equipment for power converters lacks efficient methods to test multi-wire bonding, which is crucial for ensuring proper electrical connections and reducing parasitic components.
Innovation Solution
A multi-wire bonding test circuit coupled to a converter, utilizing a multiplexer and switches to create paths for voltage and current measurements between bonding pins and feedback pins, with high-side and low-side transistors operated to test conductive states, and redundant bonding wires to ensure connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multi-wire bonding is tested using existing automated test equipment, then testing capability is provided, but testing efficiency and reliability are insufficient due to lack of dedicated test paths
Solution Approach 1:
The test circuit is segmented into multiple independent test paths, each dedicated to testing a specific bonding wire (first supply bonding wire, second supply bonding wire, first switching bonding wire, second switching bonding wire, first reference bonding wire, second reference bonding wire). Each path includes dedicated switches and measurement connections, allowing isolated testing of individual bonds without interference from other wires.
Solution Approach 2:
The patent introduces intermediary test nodes and measurement points within the bonding structure. These intermediaries allow the test equipment to access and measure individual bonding wires by creating temporary test paths through switches and connection points, enabling precise measurement of each bond's electrical characteristics without affecting the overall converter operation.
2Reliability
If redundant bonding wires are used to ensure connectivity, then reliability is improved, but parasitic components increase
Solution Approach 1:
The test circuit employs dynamic switching mechanisms that allow the redundant bonding wires to be selectively activated or deactivated based on testing requirements. During normal operation, the switches configure the circuit to minimize the presence of redundant wires, thereby reducing parasitic components. During testing, the switches dynamically reconfigure to include redundant wires in the test path, enabling verification of connectivity without permanently increasing parasitic effects.
3Measurement precision
If voltage and current measurements are made between bonding pins and feedback pins, then bonding quality is detected, but test circuit complexity increases
Solution Approach 1:
The test circuit uses universal measurement paths and shared measurement equipment that can be configured to test multiple different bonding wires through switching networks. The same voltage and current measurement infrastructure serves all six bonding wire tests by dynamically reconfiguring connection paths, avoiding the need for separate dedicated measurement circuits for each bond.
Solution Approach 2:
The test methodology changes electrical parameters (voltage, current) and measurement configurations dynamically during testing. By varying the applied voltage levels, current measurement ranges, and switch configurations, the circuit adapts to test different bonding wires with appropriate measurement settings, reducing the need for multiple fixed-parameter measurement circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable testing of supply, switching, and reference wire bonds, reducing parasitic components and ensuring proper bonding, thereby enhancing the reliability of power converters.
Implementation Method 1
The multiplexer and switches operate to create a respective path between each respective pin of the supply, switching and reference multi-wire bonding and a feedback pin
Implementation Method 2
The high-side and low-side transistors of the half-bridge are also operated during a test mode between conductive and non-conductive states to enable current flow paths between the supply, switching and reference pins
Data Source
AI summary
Provided is a power converter including first, second, third and fourth nodes and a wire bonding test circuit. The wire bonding test circuit includes a multiplexer having a first terminal of a first side coupled to the first node and second and third terminals of a second side. The wire bonding test circuit includes a first switch having a first terminal coupled to the second terminal or the third terminal of the multiplexer and a second terminal coupled to the second node. The wire bonding test circuit includes a second switch having a first terminal coupled to the second terminal or the third terminal of the multiplexer and a second terminal coupled to the third node. The wire bonding test circuit includes a third switch having a first terminal coupled to the second terminal or the third terminal of the multiplexer and a second terminal coupled to the fourth node.