Convex Chuck Ridges for Distortion-Free Substrate Bonding
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Solution Overview
Problem
In the manufacturing of stack type semiconductor devices and sensors, existing substrate bonding techniques often result in distortion defects due to the non-flat and convex surfaces of the substrates, which can alter the circular shape and lead to bonding issues.
Innovation Solution
A substrate bonding apparatus and method utilizing upper and lower chucks with convex surfaces featuring alternately disposed ridges and valleys along an azimuthal direction, allowing substrates to be bonded without distortion by bending them into a convex shape that matches the chuck's contours, using vacuum pressure or electrostatic voltage for precise alignment and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrates are bonded using conventional flat chucks, then the bonding process is simple, but distortion defects occur due to non-flat substrate surfaces
Solution Approach 1:
The chuck surface is designed with a convex curvature that matches the non-flat substrate surface. The upper chuck has a first convex surface and the lower chuck has a second convex surface, allowing the chucks to conform to the substrate's curved topology and eliminate distortion during bonding.
Solution Approach 2:
The chuck surfaces are designed with different curvatures in different regions. The convex surfaces have specific curvature radii that match the substrate's non-flat regions, allowing localized adaptation to the substrate's varying geometry across different areas.
2Measurement precision
If vacuum pressure is applied to fix substrates on chucks, then substrate positioning is precise, but substrate deformation may occur
Solution Approach 1:
The convex surfaces of the chucks are designed to match the substrate's non-flat geometry, distributing the vacuum pressure across the curved surface. This prevents localized high-pressure points that would cause deformation while maintaining precise alignment through the conformal contact.
3Strength
If substrates are bonded with convex surfaces, then bonding adhesion is improved, but distortion defects are generated
Solution Approach 1:
The chucks are designed with convex surfaces that match the substrate's convex topology. This allows the substrate to maintain its natural curved shape during bonding, achieving both strong adhesion through conformal contact and shape accuracy by preventing distortion.
Solution Approach 2:
The chuck surfaces have varying curvatures that match different regions of the substrate. This localized matching ensures optimal contact and adhesion in each region while maintaining the overall substrate shape and preventing distortion defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents distortion of substrates during bonding, maintaining their original circular shape and ensuring a flat, bubble-free interface, thereby enhancing the reliability and efficiency of the bonding process.
Implementation Method 1
using vacuum pressure or electrostatic voltage for precise alignment and adhesion
Implementation Method 2
using vacuum pressure or electrostatic voltage for precise alignment and adhesion
Data Source
AI summary
A substrate bonding apparatus includes a lower chuck that receives a lower substrate and an upper chuck disposed above the lower chuck. An upper substrate is fixed to the upper chuck. The upper chuck and the lower chuck bond the upper substrate to the lower substrate. The upper chuck has an upper convex surface toward the lower chuck. The upper convex surface includes a plurality of first ridges and a plurality of first valleys disposed alternately along an azimuthal direction.