Conductive Terminal With Convex Via For Probe Contact Stability
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Solution Overview
Problem
The stability of the chip-probing process for integrated circuits is affected by the morphology of conductive terminals, particularly due to the lack of a stable contact between the probe and the conductive terminals during testing.
Innovation Solution
The conductive terminals include a dielectric layer with specific arrangements of contact openings and a conductive via with convex portions that correspond to the openings, facilitating a stable contact with a MEMS flat tip probe, enhancing testing stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional conductive terminal structure is used, then the manufacturing process is simple, but the contact stability with the probe during chip-probing is poor
Solution Approach 1:
The conductive via is designed with a convex portion on its top surface, creating a curved protruding shape that corresponds to the contact opening. This curvature enables better mechanical contact with the flat tip probe during chip-probing, improving contact stability and testing reliability without significantly complicating the overall manufacturing process
Solution Approach 2:
The dielectric layer is configured with a contact opening that exposes only a specific portion of the conductive pad, creating a localized contact region. This local quality enhancement ensures that the probe contacts the conductive via at the optimal position, improving measurement reliability while maintaining manufacturing simplicity
2Reliability
If the conductive terminal morphology is optimized for probe contact, then the testing stability improves, but the manufacturing complexity increases
Solution Approach 1:
The conductive terminal is segmented into distinct functional portions: a conductive pad, a dielectric layer with a contact opening, and a conductive via with a convex portion. This segmentation allows each component to be optimized independently for its specific function while maintaining overall manufacturing feasibility through standard fabrication processes
Solution Approach 2:
The conductive via is designed with a three-dimensional convex portion that protrudes from the top surface of the dielectric layer. This dimensional enhancement creates a favorable contact geometry for probe interaction, improving testing stability while the convex portion can be formed using conventional plating or deposition techniques
Data Source
AI summary
A conductive terminal on an integrated circuit is provided. The conductive terminal includes a conductive pad, a dielectric layer, and a conductive via. The conductive pad is disposed on and electrically to the integrated circuit. The dielectric layer covers the integrated circuit and the conductive pad, the dielectric layer includes a plurality of contact openings arranged in array, and the conductive pad is partially exposed by the contact openings. The conductive via is disposed on the dielectric layer and electrically connected to the conductive pad through the contact openings. The conductive via includes a plurality of convex portions arranged in array. The convex portions are distributed on a top surface of the conductive via, and the convex portions are corresponding to the contact openings.