Convex Refrigerant Flow Path for Electrostatic Chuck Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current base plates used in semiconductor manufacturing devices, such as CVD and PVD apparatuses, have limitations in cooling efficiency on the side where the electrostatic chuck is mounted, which affects the overall cooling performance of wafers during vacuum treatment.
Innovation Solution
A base plate design featuring a refrigerant flow path with an upper surface that is convex and has formed unevenness, enhancing the contact area with refrigerant and improving cooling efficiency by allowing for increased refrigerant flow and heat transfer, specifically manufactured using a 3D metal printer to facilitate the formation of the complex shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional flat refrigerant flow path is used, then the structure is simple and easy to manufacture, but the cooling efficiency on the electrostatic chuck side is insufficient
Solution Approach 1:
The patent applies curvature by making the inner wall of the refrigerant flow path convex toward the electrostatic chuck side, creating a curved surface that increases the contact area between the refrigerant flow path and the electrostatic chuck. This curved configuration enhances heat transfer efficiency without requiring complex external structures
Solution Approach 2:
The patent introduces surface unevenness on the convex inner wall of the refrigerant flow path, adding a dimensional feature that increases the effective heat transfer area. This unevenness creates multiple contact points and improves thermal coupling between the flow path and electrostatic chuck
2Temperature
If the inner wall of the refrigerant flow path is made convex with unevenness, then the cooling efficiency is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent changes the geometric parameters of the refrigerant flow path by making the inner wall convex and adding unevenness features. These parameter changes optimize the heat transfer surface area and configuration, enabling improved cooling efficiency through geometric optimization rather than complex manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced base plate design significantly improves cooling efficiency on the side with the electrostatic chuck, allowing for more effective heat dissipation and improved wafer cooling during semiconductor manufacturing processes.
Implementation Method 1
a refrigerant flow path 15 extending in a thickness direction of the base plate 10
Implementation Method 2
an electrostatic chuck 30 capable of sucking and holding a wafer W
Data Source
AI summary
A base plate has one surface and the other surface opposite to the one surface. An electrostatic chuck is capable of being mounted on the one surface. The base plate includes a refrigerant flow path provided therein. An inner wall of the refrigerant flow path has an upper surface convex toward the one surface in a longitudinal sectional view in a direction intersecting with a direction in which refrigerant flows. An unevenness is formed on the upper surface.