Convex Heat Sink Attachment for Electronic Control Device
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Solution Overview
Problem
Existing electronic control devices with heat sink structures require tight temperature and time control during manufacturing to ensure reliability and quality, leading to increased costs and lower productivity.
Innovation Solution
An electronic control device with a partially open housing wall surface that incorporates a convex-shaped heat dissipating metal part with a flange, using heat dissipating and sealing filler materials to attach the metal part to the circuit board, allowing for efficient heat dissipation without stringent manufacturing controls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a dual-layer structure with resin and metal casing sections is used to achieve heat dissipation, then heat dissipation performance is improved, but manufacturing complexity increases and productivity decreases
Solution Approach 1:
The heat dissipation function is segmented from the housing structure. Instead of integrating the heat sink into the housing (dual-layer structure), the patent uses a separate metal heat dissipating fin that is attached to the housing. This segmentation allows each component to be manufactured independently using optimal processes, improving productivity while maintaining heat dissipation performance.
Solution Approach 2:
A heat dissipating sheet is introduced as an intermediary between the electronic component and the metal heat dissipating fin. This intermediary enables effective thermal coupling without requiring direct integration of metal and resin components, simplifying the manufacturing process while ensuring efficient heat transfer from the component to the heat sink.
2Reliability
If sealing plastic is used to seal the circuit board and heat dissipating fin within the housing, then sealing reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
Instead of sealing the heat dissipating fin and circuit board together with plastic (conventional approach), the patent inverts the approach by making the heat dissipating fin protrude from the housing opening. The sealing is applied only at the base where the fin attaches to the housing, eliminating the need for complex multi-component sealing while maintaining reliability.
Solution Approach 2:
The heat dissipating fin is extracted from the sealed internal structure and positioned externally, protruding from the housing. This extraction eliminates the need to seal around the fin itself, reducing sealing complexity while maintaining the protective sealing at the critical attachment point between the fin and housing.
3Manufacturing precision
If tight temperature and time control is implemented during manufacturing to ensure quality, then product quality is improved, but production cost increases and productivity decreases
Solution Approach 1:
The metal heat dissipating fin with its flange structure provides self-aligning and self-positioning features during assembly. The flange fits into the housing opening, automatically guiding the fin into the correct position and reducing the need for precise manual alignment and tight process control, thereby improving production speed without sacrificing quality.
Solution Approach 2:
The patent replaces complex sealing and integration mechanisms with simpler mechanical attachment using the flange structure. This mechanical substitution eliminates the need for complex molding processes and tight temperature-time control, allowing for faster, more flexible assembly while maintaining manufacturing quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a high-grade heat sink that is structurally simple, cost-effective, and can be produced at a higher rate with sufficient sealability, reducing the need for tight manufacturing controls and improving productivity.
Implementation Method 1
a top section of the metal part comes into contact with a position on the circuit board corresponding to the mounting position of the electronic component with a heat dissipating filler material placed therebetween
Implementation Method 2
a convex-shaped heat dissipating metal part having a flange on its bottom side is attached to the opening from outside
Data Source
AI summary
The invention provides an electronic control device having a high-grade heat sink that: does not require tight control at the time of manufacturing; is structurally simple; can be produced at a higher production rate; and is cost-effective. In this device, when a circuit board 14 having an electronic component 13 thereon is placed in a non-metal (resin) housing having: a housing base 11 integrally comprising via a partition wall lie a connector inserting section 18 used for electrical connection with an external mating connector (not illustrated); and a housing cover 12 attached to the housing base 11, part of the board 14 is inserted into an insertion hole provided in the partition wall lie so that it is exposed inside the connector inserting section 18. When a convex-shaped metal part 15, used as a heat sink, having a flange 15a on the bottom side is attached from an opening provided in the housing base 11, the top section of the metal part 15 comes into contact with mounting position of the electronic component 13 on the board 14 via a heat dissipating filler material 16, and the flange 15a and the wall section near the opening are brought into contact with each other via a sealing filler material 17.