Convex Interconnect IC Packaging Eliminates Solder Bridging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated circuit packaging systems face challenges in achieving high input/output density, low cost, and improved reliability due to increased miniaturization and functionality integration, with existing solutions failing to provide effective electrical interconnection and avoiding issues like solder ball bridging and environmental impact.
Innovation Solution
The system includes a substrate with a convex interconnect having a protrusion and horizontal flange, an insulation layer, and a single interlayer conductive connector, eliminating the need for solder balls by integrating the convex interconnect as a built-in bump structure for interconnectivity, which enhances yield, reliability, and reduces environmental impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging methods with solder balls are used, then electrical interconnection is achieved, but solder ball bridging occurs and reliability decreases
Solution Approach 1:
The patent removes solder balls from the packaging system and replaces them with a convex interconnect structure that is integrated into the substrate. This extraction eliminates the harmful bridging effect while maintaining electrical interconnection functionality between the integrated circuit die and external circuitry.
Solution Approach 2:
The convex interconnect acts as an intermediary structure between the integrated circuit die and the substrate external layer. It provides a reliable electrical connection path without using solder balls, thereby preventing bridging issues while achieving the necessary electrical interconnection.
2Volume of moving object
If miniaturization is increased to reduce product size, then product dimensions decrease, but input/output density becomes difficult to maintain
Solution Approach 1:
The patent transitions from a planar two-dimensional interconnection approach to a three-dimensional structure with the convex interconnect having both horizontal flange and vertical protrusion components. This dimensional change allows for higher input/output density within a smaller footprint, enabling miniaturization without sacrificing connection density.
Solution Approach 2:
The horizontal flange and vertical protrusion of the convex interconnect are merged into a single integrated structure that simultaneously provides both lateral and vertical electrical connections. This merging enables more efficient use of space and maintains high input/output density while reducing overall product size.
3Ease of manufacture
If manufacturing complexity is reduced to lower cost, then production cost decreases, but manufacturing precision may be compromised
Solution Approach 1:
The convex interconnect structure is formed as a built-in feature during substrate manufacturing, before the actual packaging assembly process. This preliminary formation of the interconnect structure eliminates the need for separate solder ball attachment steps, reducing manufacturing complexity and cost while maintaining precision through integrated fabrication processes.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a substrate external layer having an opening; forming a convex interconnect within the opening with the convex interconnect having a protrusion and a horizontal flange substantially horizontally coplanar with the substrate external layer; forming an insulation layer over the substrate external layer and the convex interconnect; forming a horizontal conductive pathway on the insulation layer; forming a single interlayer conductive connector from the horizontal conductive pathway to the convex interconnect; and connecting an integrated circuit and the horizontal conductive pathway.