Convex Pick-and-Place Head for Gap-Free Chip Bonding
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Solution Overview
Problem
In integrated circuit manufacturing, the placement of dies on wafers or package substrates requires precise control to prevent the formation of gaps or air gaps at the interface, which can lower the yield of the bonding process.
Innovation Solution
A pick-and-place tool with an attaching head featuring a convex surface and suction holes is used to deform the chip, ensuring the center portion contacts the substrate before the edges, thereby preventing gaps and providing stable attachment through uniform suction force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flat attaching head is used to pick up the chip, then the structure is simple, but the chip may form gaps or air gaps at the interface during bonding
Solution Approach 1:
The attaching head is designed with a convex surface that protrudes toward the chip, creating a curved geometry instead of a flat surface. This convex shape ensures that the center portion of the chip contacts the substrate first during bonding, preventing the formation of gaps or air gaps at the interface, thereby improving bonding reliability without excessive complexity
2Reliability
If the chip is placed directly on the substrate without deformation control, then the process is simple, but gaps may form at the interface lowering bonding yield
Solution Approach 1:
The chip is deformed in advance by the convex surface of the attaching head before placement on the substrate. This preliminary deformation ensures that the center portion of the chip is positioned to contact the substrate first during bonding, preventing gap formation and improving bonding yield without requiring complex real-time control during the bonding process
3Strength
If uniform suction force is applied across the entire chip, then attachment is stable, but the chip may be damaged during deformation
Solution Approach 1:
The suction holes in the attaching head are arranged with different densities in different regions: a first density in a first region and a second density in a second region, where the second density is greater than the first density. This non-uniform distribution allows for stable attachment while preventing damage by applying stronger suction force locally at critical areas rather than uniformly across the entire chip
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures reliable bonding without damaging the chip and maintains high yield by ensuring the center portion of the chip contacts the substrate first, preventing air gaps and potential breakage during the bonding process.
Implementation Method 1
The attaching head has a plurality of suction holes penetrating the attaching surface, and the attaching head attracts the chip using the suction force via the suction holes
Data Source
AI summary
A pick-and-place tool includes a bond base and an attaching head. The attaching head is connected to the bond base and configured to attract a chip by a suction force. The attaching head has an attaching surface that is convex toward the chip, the attaching head has a plurality of suction holes penetrating the attaching surface, and the attaching head attracts the chip using the suction force via the suction holes.