Convex Resin Protrusion Electrical Coupling for Thermal Stability
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Solution Overview
Problem
The challenge in maintaining stable electrical contact between semiconductor devices and wiring substrates under varying temperature conditions due to differences in thermal expansion coefficients of materials used in chip-on-glass (COG) structures, leading to potential conductive disconnection.
Innovation Solution
The implementation of a semiconductor device with a convex-shaped resin protrusion and electrical coupling sections that project in a longitudinal direction, increasing the contact area and maintaining electrical contact stability despite thermal expansion variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a convex-shaped resin protrusion is used to provide elastic deformation, then reliability of electrical contact is improved, but deformation variation near end portions increases leading to potential conductive disconnection
Solution Approach 1:
The electrical coupling sections are designed with curved or bent shapes instead of straight lines, allowing them to better accommodate the non-uniform deformation of the convex-shaped resin protrusion. This curvature enables the coupling sections to maintain contact across the varying deformation profile, particularly near the end portions where deformation is greatest.
Solution Approach 2:
The electrical coupling sections have different shapes at different locations - curved or bent shapes are specifically applied to sections near the end portions of the resin protrusion where deformation is more significant, while other sections may have different configurations. This localized adaptation ensures optimal contact maintenance throughout the entire structure.
2Adaptability or versatility
If materials with different thermal expansion coefficients are used in the electrical contact section, then adaptability to temperature changes is improved, but variation in deformation amount increases causing contact deterioration
Solution Approach 1:
The patent utilizes the different thermal expansion parameters of materials (glass substrate, resin protrusion, conductive film) to create a controlled deformation system. By designing the electrical coupling sections with curved shapes, the system accommodates the parameter variations caused by thermal expansion, transforming the potential harmful effect into a manageable design parameter.
Solution Approach 2:
The patent converts the harmful effect of differential thermal expansion into a beneficial feature by designing the electrical coupling sections to leverage the deformation caused by different expansion rates. The curved shapes are specifically configured to maintain contact by utilizing the natural deformation pattern created by thermal expansion differences.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures reliable electrical contact and prevents deterioration of the contact state even with thermal expansion, enhancing the device's ability to withstand temperature changes.
Implementation Method 1
it is necessary to fix the relative position of the IC chip to the glass substrate in a state that the conductive particles between them are elastically deformed
Implementation Method 2
even if the thermoset resin is thermally expanded due to temperature changes
Implementation Method 3
the resin protrusion constituting the bump electrode is elastically deformed. Because the resin protrusion constituting the bump electrode is sufficiently larger than the conductive particles contained in the ACF, a predetermined amount of elastic deformation can be obtained
Data Source
AI summary
An electronic device includes a semiconductor device and a wiring substrate having a wiring pattern. The semiconductor device includes: a semiconductor chip having an electrode; a convex-shaped resin protrusion provided on a surface of the semiconductor chip, the surface having the electrode; and wiring having a plurality of electrical coupling sections which are aligned on the resin protrusion and electrically coupled to the electrode. The semiconductor device is mounted to the wiring substrate so that the electrical coupling sections and the wiring pattern are brought into contact and electrically coupled with each other. The plurality of electrical coupling sections brought into contact with the wiring pattern include curved or bent shapes projecting in a longitudinal direction of the resin protrusion.