Convexo-Concave Interposer Surface Design for Shielding and Yield
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Solution Overview
Problem
The challenge in electronic devices is the inefficiency in utilizing mounting spaces due to the drilling process for interposers, which results in a loss of slit space and limits the number of finished products, and the need for improved cost-effectiveness and electromagnetic wave shielding.
Innovation Solution
An interposer with a convexo-concave outer and inner surface, featuring conductive vias and a side conductive member, is designed to reduce spacing distances and slit space width, allowing for increased product numbers and enhanced electromagnetic wave shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a drilling process is used to form via holes in the interposer, then conductive vias can be formed to provide electrical paths, but slit space is lost and the number of finished products decreases
Solution Approach 1:
The interposer is divided into multiple individual units arranged in an array, with each unit containing its own via holes and conductive vias. This segmentation allows mass production through simultaneous processing of multiple units, increasing the number of finished products while maintaining reliable electrical connections in each unit.
Solution Approach 2:
Via holes are pre-formed in the interposer material before the conductive vias are deposited. This preliminary action of creating the hole structure first allows for efficient subsequent filling and sealing processes, reducing overall manufacturing time and increasing productivity.
2Ease of manufacture
If the interposer uses a flat surface design, then manufacturing is simpler, but spacing distances between surfaces and conductive vias are larger, reducing product yield
Solution Approach 1:
The interposer surface is designed with convexo-concave features instead of a flat surface. The convex portions allow conductive vias to be positioned closer to the inner surface, reducing spacing distances and increasing the number of via holes that can be accommodated, thereby improving product yield while remaining manufacturable.
3Device complexity
If the interposer lacks electromagnetic wave shielding, then the structure is simpler and cost is lower, but electromagnetic interference affects performance
Solution Approach 1:
The shielding function is merged with the existing side conductive members that are already present in the interposer structure. By configuring these conductive members to extend along the outer surface and connect to ground, the interposer simultaneously provides electrical connection and electromagnetic wave shielding without adding separate shielding components, thus maintaining simplicity while improving performance.
Data Source
AI summary
An electronic device is provided. The electronic device comprises an interposer disposed between first circuit board and second circuit board, and including an opening area and for accommodating the at least one electronic component, and the interposer comprises a board including an inner surface that faces the opening area and an outer surface that faces an opposite direction to the inner surface, wherein the outer surface is formed in a convexo-concave form having a plurality of first concave areas and a plurality of first concave areas, and a side conductive member disposed on the first concave areas and the first concave areas of the outer surface, and formed along the convexo-concave form of the outer surface.