Substrate Conveying Fork Grooves Eliminate Support Plate Deposition
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Solution Overview
Problem
Existing substrate conveying systems require a substrate support plate, which leads to issues like deposition accumulation, temperature management, and cross-contamination, especially for substrates needing front and back side deposition.
Innovation Solution
A substrate conveying device with a mechanical arm and fork structure that supports substrates using grooves on parallel branches, eliminating the need for a substrate support plate by using substrate bearing columns and pedestals for heating and cooling, and allowing direct processing on a pedestal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a substrate support plate is used to convey substrates, then substrate conveying is enabled, but deposition accumulates on the support plate requiring periodic cleaning
Solution Approach 1:
The patent removes the substrate support plate from the system entirely. Instead of using a support plate to convey substrates, the invention uses individual substrate bearing columns that directly support and convey substrates through the processing chambers. This extraction of the support plate eliminates the deposition accumulation problem on the plate surface while maintaining substrate conveying capability.
Solution Approach 2:
The patent segments the substrate support function into individual substrate bearing columns for each substrate position, rather than using a single unified support plate. Each bearing column independently supports one substrate, allowing substrates to be conveyed without a shared support surface where deposition would accumulate.
2Loss of time
If substrate support plate is preheated to reduce process reaction time, then productivity improves, but additional heating time and energy are required
Solution Approach 1:
The patent combines the substrate support function with the heating/cooling function into the same substrate bearing column structure. The bearing columns are thermally coupled to heating and cooling systems, allowing direct thermal management of substrates during conveyance and processing, eliminating the need for separate preheating of a large support plate.
Solution Approach 2:
The patent applies heating and cooling directly at the substrate location through the substrate bearing columns, rather than heating a large support plate surface. This localized thermal management reduces energy consumption by heating only the necessary substrate areas and minimizes thermal mass that would require energy to heat.
3Reliability
If substrate support plate is cooled after processing, then substrate cracking is prevented, but additional cooling time is required
Solution Approach 1:
The patent integrates cooling functionality directly into the substrate bearing columns, which are used throughout the entire substrate processing cycle. The same columns that convey and support substrates during processing also provide cooling after processing, eliminating the need for separate cooling steps and reducing total processing time while maintaining substrate quality.
4Reliability
If separate substrate support plates are used for front and back side deposition, then cross-contamination is avoided, but substrate transfer between plates is required
Solution Approach 1:
The patent segments the substrate support system into individual substrate bearing columns, where each column can independently support a substrate. For substrates requiring front and back side deposition, the substrate can be rotated or repositioned on the same bearing column rather than transferring to a different support plate, eliminating cross-contamination risks while simplifying the system.
Solution Approach 2:
The substrate bearing columns are designed to be universal support structures that can handle substrates for both front side and back side deposition processes. The same bearing column can support a substrate during front side processing, then the substrate can be rotated or repositioned on the same column for back side processing, eliminating the need for separate support plates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the need for substrate support plate maintenance, improves processing efficiency by rapid heating and cooling, and minimizes cross-contamination, enhancing the yield of substrate processing.
Implementation Method 1
A plurality of grooves are formed in each of the branches, a plurality of grooves in every adjacent branches are oppositely arranged. Every groove in each branch and the groove opposite on the adjacent branch form a wafer supporting structure.
Implementation Method 2
pedestals for heating and cooling, and allowing direct processing on a pedestal
Implementation Method 3
pedestals for heating and cooling, and allowing direct processing on a pedestal
Data Source
AI summary
A conveying device for conveying at least a first row of substrates and a second row of substrates, includes: a conveying fork having a main body and a plurality of branches, a first end of each of the branches is connected to the main body, and a second end of each of the branches is a free end; wherein a first branch of the plurality branches has a first plurality of grooves, and a second branch of the plurality of branches has a second plurality of grooves; and wherein one of the first plurality of grooves and one of the second plurality of grooves are configured to support one of the substrates in the first row.