Conveying Robot Preheating for Faster Substrate Processing

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Solution Overview

Problem

Current substrate processing apparatuses require significant time to heat substrates to a predetermined temperature, which prolongs the semiconductor manufacturing process and hinders production efficiency.

Innovation Solution

Incorporating a pre-heating means in the conveying robot and/or loadlock chamber, utilizing both contact and non-contact heating methods to pre-heat substrates before processing, thereby reducing the time needed for the process chamber to reach the target temperature.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heater embedded in the electrostatic chuck is used to heat the substrate, then the substrate can be heated to a predetermined temperature, but the process time becomes excessively long

Engineering Contradiction:
Improvesubstrate temperatureVSAvoidprocess time
Core Design Contradiction:
TemperatureVSLoss of time

Solution Approach 1:

The patent applies preliminary action by pre-heating the substrate in the conveying robot before the substrate enters the process chamber. The pre-heating means includes a heater that heats the substrate to a predetermined temperature (e.g., 100°C to 200°C) during the conveying process, so that when the substrate reaches the process chamber, it is already at a higher temperature, reducing the time required for the process chamber heater to reach the target processing temperature.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The heating process is segmented into two stages: pre-heating in the conveying robot and final heating in the process chamber. The conveying robot is divided into a conveying unit and a pre-heating unit, allowing the heating function to be separated from the processing function. This segmentation enables parallel operations where heating occurs during transport rather than waiting in sequence.

Inventive Principle:
Principle #1Segmentation

2Stability of the object's composition

If the substrate is heated slowly to ensure uniform temperature distribution, then temperature uniformity is improved, but the process time increases

Engineering Contradiction:
Improvetemperature uniformityVSAvoidheating time
Core Design Contradiction:
Stability of the object's compositionVSLoss of time

Solution Approach 1:

The patent applies local quality by positioning the heater in close proximity to the substrate surface in the conveying robot. The pre-heating means includes a heater that directly contacts or closely approaches the substrate, providing localized intense heating on the substrate surface. This localized heating approach quickly raises the substrate temperature without requiring long-duration uniform heating throughout the entire substrate thickness.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly shortens the time required to heat substrates to a target temperature, thereby reducing the overall process time and enhancing production efficiency in substrate processing.

Implementation Method 1

the hand pre-heats the substrate in the state before processing by a contact heating method using the heater

Methodology Applied
Scientific EffectContact heating: Conduction (thermal)

Implementation Method 2

the hand pre-heats the substrate in the state before processing by a non-contact heating method using the heating lamp member

Methodology Applied
Scientific EffectNon-contact heating: Thermal Radiation

Implementation Method 3

supplies DC power to a DC electrode embedded in an electrostatic chuck (ESC) to electrostatically adsorb a substrate to the electrostatic chuck

Methodology Applied
Scientific EffectElectrostatic adsorption: Electrostatics

Implementation Method 4

the process chamber forms plasma in a reaction space of the chamber by supplying high-frequency bias power to the ESC

Methodology Applied
Scientific EffectPlasma formation: Plasma

Data Source

PatentUS11978654B2Substrate processing apparatus
Publication Date: 2024.05.07 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US11978654B2 patent drawing
  • US11978654B2 patent drawing
  • US11978654B2 patent drawing

AI summary

The present invention relates to a substrate processing apparatus capable of shortening a process time, and the substrate processing apparatus according to the present invention comprises an index chamber having a transfer robot loading/unloading a substrate; a process chamber having a heating means heating the substrate and processing the substrate; a loadlock chamber disposed between the index chamber and the process chamber; and a conveying chamber having a conveying robot conveying the substrate between the process chamber and the loadlock chamber, wherein a pre-heating means is provided in the conveying robot to pre-heat the substrate in a state before processing.