Cooking Appliance Frame Cooling for Compact Electronics Layout
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Solution Overview
Problem
Existing cooking appliances are bulky and inefficient in heat management, with electronic components often exposed to high temperatures due to lack of effective cooling and maintenance-intensive air filtration systems, which compromises their compactness and stability.
Innovation Solution
A compact cooking appliance design featuring a self-supporting frame that houses all electronic components, including an active cooling fan without a filter, and a component carrier with cooling fins, ensuring efficient air circulation and heat dissipation within the frame, while maintaining a sleek and stable form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electronic components are housed outside the frame for accessibility, then assembly is easier, but the device becomes bulkier and heat management becomes inefficient
Solution Approach 1:
The patent merges the frame structure with the housing to form an integrated unit. The frame is designed as a self-supporting structure that simultaneously serves as the outer housing, eliminating the need for separate housing components. This integration allows electronic components to be mounted directly on the frame's inner surfaces, reducing overall device volume while maintaining assembly accessibility through strategically placed mounting areas.
2Object-affected harmful factors
If a filter is installed for air filtration, then air quality improves, but maintenance requirements increase
Solution Approach 1:
The patent removes the filter component entirely from the air circulation system. Instead of using a filter to clean the air, the design relies on natural air circulation through the frame structure and the heat dissipation process itself to maintain air quality. This extraction of the filter element eliminates maintenance requirements while still achieving the goal of clean air circulation through passive means.
3Stability of the object's composition
If the frame forms a closed structure, then structural stability improves, but heat dissipation becomes difficult
Solution Approach 1:
The patent applies local quality by creating selective openings and ventilation areas at specific locations on the frame where heat accumulation occurs. The frame maintains its closed and stable structure in most areas, but incorporates localized air circulation channels and openings strategically positioned to facilitate heat dissipation from electronic components without compromising overall structural integrity.
4Temperature
If cooling fins are added to the component carrier, then heat dissipation improves, but device complexity increases
Solution Approach 1:
The patent merges the cooling fins directly with the component carrier structure, making them an integrated part of the mounting platform rather than separate attachments. The component carrier is designed with fin structures that extend from its surfaces, creating a unified heat dissipation system. This integration improves heat dissipation efficiency while avoiding the complexity of separate cooling component assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective heat management, maintaining temperatures between 60°C to 85°C on electronic components and preventing heat accumulation, eliminating the need for air filtration maintenance and enhancing the appliance's compactness and stability.
Implementation Method 1
an active cooling device for the electronic/electrical components, with at least one electrically driven cooling unit housed inside the frame. This cooling unit is in particular a cooling fan
Implementation Method 2
a component carrier made of metal, preferably light metal such as aluminum, which is designed as a separate part opposite the frame, is provided inside the frame. The component carrier carries one or more electrical or electronic components on one side. Such a component is in particular a solid state relay... The component carrier has cooling fins for this purpose
Data Source
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AI summary
The apparatus has swingable lids (14, 16) for opening and closing tiltably mounted, heatable crucibles (10, 12). The crucibles are provided with a front edge (18), a rear edge and a lateral edge (22). A table top frame (26) is provided at the front edge of the crucible in a frame-free manner, and designed in a T-shape. The crucibles extend along the rear and lateral edges, and arranged next to each other in a parallelepiped shape. A central web (28) upwardly projects opposite to a top surface of the closed lids. A transformer is accommodated in a transverse web (30).